scholarly journals High-performance thin H:SiON OLED encapsulation layer deposited by PECVD at low temperature

RSC Advances ◽  
2019 ◽  
Vol 9 (1) ◽  
pp. 58-64 ◽  
Author(s):  
Kyoung Woo Park ◽  
Seunghee Lee ◽  
Hyunkoo Lee ◽  
Yong-Hwan Cho ◽  
Yong Cheon Park ◽  
...  

High-performance H:SiON single layer thin film encapsulation (TFE) was deposited by plasma enhanced chemical vapor deposition (PECVD) method. To control the characteristics of the SiON thin films, hydrogen gas was introduced during PECVD process.

RSC Advances ◽  
2017 ◽  
Vol 7 (18) ◽  
pp. 10798-10805 ◽  
Author(s):  
Beibei Guo ◽  
Lanli Chen ◽  
Siqi Shi ◽  
Ahmad Ishaq ◽  
Dongyun Wan ◽  
...  

High-performance thermochromic VO2 films were fabricated by LPCVD, and the mechanism for their low transition temperatures was studied using first-principles calculations.


2007 ◽  
Vol 515 (5) ◽  
pp. 2921-2925 ◽  
Author(s):  
Chunyu Wang ◽  
Volker Cimalla ◽  
Genady Cherkashinin ◽  
Henry Romanus ◽  
Majdeddin Ali ◽  
...  

1998 ◽  
Vol 547 ◽  
Author(s):  
Michael P. Remington ◽  
Smuruthi Kamepalli ◽  
Philip Boudjouk ◽  
Bryan R. Jarabek ◽  
Dean G. Grier ◽  
...  

AbstractThe low temperature (ca. 300°C) deposition of antimony films by low-pressure chemical vapor deposition (LPCVD) on glass substrates from tribenzylantimony, Bn3Sb, is described. The facile elimination of the benzyl ligands results in preferentially oriented antimony films with low carbon content. The pyrolysis, decomposition mechanism and precursor design strategies are discussed. In addition, the deposition of bismuth from tribenzylbismuth, Bn3Bi, is presented. The potential for alloy growth using these precursors is discussed. Resulting films were characterized by XRD, SEM, and AFM.


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