scholarly journals Quantitative imaging of magnetic field distribution using a pyrene-based magnetosensing exciplex fluorophore

2019 ◽  
Vol 18 (11) ◽  
pp. 2688-2695 ◽  
Author(s):  
Dongkyum Kim ◽  
Minhyuk Jung ◽  
Hyoungjoong Kim ◽  
Won-jin Chung ◽  
Hohjai Lee
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Quantitative Imaging ◽  
Magnetic Field Distribution ◽  
Mild Conditions ◽  
Magnetic Field Imaging ◽  
Field Imaging

Py-12-O-2-DMA was used for a quantitative magnetic field imaging in mild conditions with 375 nm LED excitation. It was ca. 24.7 times brighter than a previously reported phenanthrene-based complex when excited by 355 nm excitation.

scholarly journals Quantitative imaging of the magnetic field distribution in an artificial spin ice studied by off-axis electron holography

2021 ◽  
pp. 168535
Author(s):  
Teresa Weßels ◽  
András Kovács ◽  
Sebastian Gliga ◽  
Simone Finizio ◽  
Jan Caron ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Quantitative Imaging ◽  
Magnetic Field Distribution ◽  
Electron Holography ◽  
Spin Ice ◽  
Artificial Spin Ice ◽  
The Magnetic Field

Magnetic Field Imaging for 3D applications

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001937-001965
Author(s):  
Jan Gaudestad ◽  
Antonio Orozco
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Quantum Interference ◽  
Device Fabrication ◽  
Fault Isolation ◽  
Current Path ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging ◽  
A Current

The challenges that 3D integration present to Failure Analysis require the development of new Fault Isolation techniques that allows for non-destructive, true 3D failure localization. By injecting a current in the device under test (DUT), the current generates a magnetic field around it and this magnetic field is detected by a sensor above the device. Magnetic field imaging (MFI) is a natural candidate for 3D Fault Isolation of complex 3D interconnected devices. This is because the magnetic field generated by the currents in the DUT passes unaffected through all materials used in device fabrication; the presence of multiple metal layers, dies or other opaque layers do not have any impact on the magnetic field signal. The limitations of the technique are not affected by the number of layers in the stacked devise in samples such as wirebonded stacked memory, Through Silicon Via (TSV) stacked die or even package on package (PoP). The sample is raster scanned and magnetic field is acquired at determined steps providing a magnetic image of the field distribution. This magnetic field data is typically processed using a standard inversion technique to obtain a current density map of the device. The resulting current map can then be compared to a circuit diagram, an optical or infrared image, or a non-failing part to determine the fault location. Today, giant-magnetoresistive (GMR) sensors have been added to the Superconducting Quantum Interference Device (SQUID) sensor to allow higher resolution and Fault Isolation (FI) I at die level. Magnetic Field Imaging (MFI), using SQUID as the high sensitive magnetic sensor in combination with a high resolution GMR sensor. A solver algorithm capable of successfully reconstructing a 3D current path based on an acquired magnetic field image from both sensors has been developed. The generic 3D inverse problem has no unique solution. Given a particular 3D magnetic field distribution, there are an infinite number of current path distributions that will result in such magnetic field. This ill-posed problem has restricted, so far, the use of magnetic imaging to 2D. A different kind of 3D solver can be constructed, nevertheless capable of obtaining a single solution. The 3D solver algorithm is not only capable of extracting the 3D current path, but it also provides valuable geometrical information about the device. Accurately being able to position each current segment in a layer allows the FA engineer to follow the current as it vertically moves from one die (or layer) to another. [1,2,3]

Analysis of Magnetic Field Distribution around Connector with Contact Failure

2012 ◽  
Vol 132 (6) ◽  
pp. 417-420
Author(s):  
Yu-ichi Hayashi ◽  
Takaaki Mizuki ◽  
Hideaki Sone
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Magnetic Field Distribution ◽  
Contact Failure

Magnetic Field Distribution in Aperture of TEM Horn Antenna for Close Proximity RF Immunity Test by Impulsive Excitation Wave

2020 ◽  
Vol 140 (12) ◽  
pp. 601-602
Author(s):  
Gen Kawakami ◽  
Ken Kawamata ◽  
Shinobu Ishigami ◽  
Takeshi Ishida ◽  
Katsushige Harima ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Horn Antenna ◽  
Magnetic Field Distribution ◽  
Excitation Wave ◽  
Impulsive Excitation ◽  
Close Proximity ◽  
Tem Horn

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

A multi-magneto-inductive sensor array system for real-time magnetic field imaging of ferromagnetic targets

2021 ◽  
Vol 92 (3) ◽  
pp. 035113
Author(s):  
Huan Liu ◽  
Changfeng Zhao ◽  
Xiaobin Wang ◽  
Zehua Wang ◽  
Jian Ge ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Real Time ◽  
Sensor Array ◽  
Inductive Sensor ◽  
Magnetic Field Imaging ◽  
Field Imaging

Evaluation of magnetic field distribution of superconducting bulk magnets with the same pole arrangement

2008 ◽  
Vol 468 (15-20) ◽  
pp. 2165-2169 ◽  
Author(s):  
K. Yokoyama ◽  
T. Oka ◽  
K. Noto
Keyword(s):  
Magnetic Field ◽  
Field Distribution ◽  
Magnetic Field Distribution
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