A p-Type PbS Quantum Dot Ink with Improved Stability for Solution Processable Optoelectronics

2021 ◽  
Author(s):  
Fiaz Ahmed ◽  
John Hardin Dunlap ◽  
Perry J. Pellechia ◽  
Andrew Greytak

A highly stable p-type PbS-QDs ink is prepared using a single-step biphasic ligand exchange route, overcoming instability encountered in previous reports. Chemical characterization of the ink reveals 3-mercaptopriopionic acid (MPA)...

2021 ◽  
Author(s):  
Fiaz Ahmed ◽  
John Dunlap ◽  
Perry Pellechia ◽  
Andrew Greytak

2013 ◽  
Vol 42 (5) ◽  
pp. 809-814 ◽  
Author(s):  
Ayomide Atewologun ◽  
Wangyao Ge ◽  
Adrienne D. Stiff-Roberts

2018 ◽  
Vol 459 ◽  
pp. 562-571 ◽  
Author(s):  
Hossein Beygi ◽  
Seyed Abdolkarim Sajjadi ◽  
Abolfazl Babakhani ◽  
Jeff F. Young ◽  
Frank C.J.M. van Veggel

RSC Advances ◽  
2020 ◽  
Vol 10 (51) ◽  
pp. 30707-30715
Author(s):  
Anju Elsa Tom ◽  
Ajith Thomas ◽  
V. V. Ison

Quantum dots (QDs) solids with iodide passivation are a key component for most of the well-performing PbS QDs solar cells.


2016 ◽  
Vol 3 (6) ◽  
pp. 1500432 ◽  
Author(s):  
Jiajun Peng ◽  
Yani Chen ◽  
Xianfeng Zhang ◽  
Angang Dong ◽  
Ziqi Liang

1986 ◽  
Vol 70 ◽  
Author(s):  
R. E. Rocheleau ◽  
S. C. Jackson. ◽  
S. S. Hegedus ◽  
B. N. Baron

ABSTRACTChemical vapor deposition techniques, in particular plasma enhanced CVD, have been used to produce high quality a-Si:H materials. Continuing research is directed toward increased device performance, improved stability, and translation of scale to commercial production. A part of this effort is the evaluation of alternate CVD techniques which in addition to providing technical options for high efficiency and long term stability are likely to lead to improved understanding of the relationships between deposition processes and material properties. A relatively new technique for depositing a-Si:H is photo-CVD which utilizes ultraviolet light to initiate the decomposition of silane or disilane. The best results from both materials properties and device efficiency points of view have been achieved using mercury sensitized photo-CVD. Recently, a 10.5% efficient a-Si:H p-i-n photovoltaic cell, fabricated by photo-CVD, was reported [1]. A limitation in photo-CVD has been preventing deposition on the UV transparent window. In this paper we describe a new photo-CVD reactor with a moveable UV-transparent Teflon film and secondary gas flows to eliminate window fouling. The deposition and opto-electronic characterization of intrinsic a-Si:H and a-SiGe:H and p-type a-SiC:H are described. Finally, preliminary results of p-i-n solar cells are presented.


Small ◽  
2016 ◽  
Vol 13 (5) ◽  
pp. 1602956 ◽  
Author(s):  
Aabhash Shestha ◽  
Yanting Yin ◽  
Gunther G. Andersson ◽  
Nigel A. Spooner ◽  
Shizhang Qiao ◽  
...  

Energies ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 5037
Author(s):  
Akihiro Takahashi ◽  
Haibin Wang ◽  
Takeshi Fukuda ◽  
Norihiko Kamata ◽  
Takaya Kubo ◽  
...  

We constructed ZnO/PbS quantum dot (QD) heterojunction solar cells using liquid-phase ligand exchange methods. Colloidal QD solutions deposited on ZnO-dense layers were treated at different temperatures to systematically study how thermal annealing temperature affected carrier transport properties. The surface of the layers became dense and smooth as the temperature approached approximately 80 °C. The morphology of layers became rough for higher temperatures, causing large grain-forming PbS QD aggregation. The number of defect states in the layers indicated a valley-shaped profile with a minimum of 80 °C. This temperature dependence was closely related to the amount of residual n-butylamine complexes in the PbS QD layers and the active layer morphology. The resulting carrier diffusion length obtained on the active layers treated at 80 °C reached approximately 430 nm. The solar cells with a 430-nm-thick active layer produced a power conversion efficiency (PCE) of 11.3%. An even higher PCE is expected in solar cells fabricated under optimal annealing conditions.


2019 ◽  
Vol 11 (29) ◽  
pp. 26047-26052 ◽  
Author(s):  
Hadi Tavakoli Dastjerdi ◽  
Rouhollah Tavakoli ◽  
Pankaj Yadav ◽  
Daniel Prochowicz ◽  
Michael Saliba ◽  
...  

1999 ◽  
Vol 605 ◽  
Author(s):  
J. J. McMahon ◽  
J. J. McMahon ◽  
J. M. Melzak ◽  
C. A. Zorman ◽  
J. Chung ◽  
...  

AbstractIn an effort to develop thick, p-type polycrystalline silicon (polysilicon) films for microelectromechanical systems (MEMS) applications, in-situ boron-doped polysilicon films were deposited by a single-step APCVD process at susceptor temperatures ranging from 700°C to 955°C. The process produces boron-doped films at a deposition rate of 73 nm/min at 955°C. Spreading resistance measurements show that the boron doping level is constant at 2 × 1019 /cm3 throughout the thickness of the films. Doped films deposited at the low temperatures exhibit compressive stress as high as 666 Mpa; however films deposited at 955°C exhibited stress as low as 130 MPa. TEM and XRD show that the microstructure strongly depends on the deposition conditions. Surface micromachined, singly clamped cantilevers and strain gauges were successfully fabricated and used to characterize the residual stress of 5.0 µm-thick doped films deposited at a susceptor temperature of 955°C.


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