Electromagnetic interference shielding materials: recent progress, structure design, and future perspective

Author(s):  
Xiao-Yun Wang ◽  
Si-Yuan Liao ◽  
Yan-Jun Wan ◽  
Peng-Li Zhu ◽  
You-Gen Hu ◽  
...  

Novel structure design and shielding mechanism of various shielding materials are critically reviewed. Measurement methods of far-field and near-field shielding are presented. Challenges and future perspectives for shielding materials are discussed.

Carbon ◽  
2021 ◽  
Vol 177 ◽  
pp. 304-331
Author(s):  
Rajesh Kumar ◽  
Sumanta Sahoo ◽  
Ednan Joanni ◽  
Rajesh K. Singh ◽  
Wai Kian Tan ◽  
...  

2021 ◽  
pp. 2151041
Author(s):  
Wei Wang ◽  
Xiaoyu Bing ◽  
Yutong Zhou ◽  
Miaomiao Geng ◽  
Yanhu Zhan ◽  
...  

The structural design of thin films is attracting attention in academia and industry in attempts to improve electromagnetic interference shielding effectiveness (EMI SE). In this study, MXene/chitosan/silver nanowire (AgNW) sandwich films, in which the AgNW core layer was bordered by two MXene/chitosan layers, were fabricated by vacuum-assisted filtration. Because of the interconnected AgNWs in the core layer and the aligned MXene sheets in the MXene/chitosan layers, the electrical conductivity of the sandwich film reached 11,459.1 S/m. Consequently, the sandwich film exhibited an SE value of 82.3 dB. What is more, when both the AgNW and MXene contents were 33.3%, the sandwich film’s EMI SE divided by its thickness was 26,167 dB/cm, which was much superior to the values reported for inorganic hybrid composites and polymer composites filled with hybrid fillers. Such a simple approach was proved to be an effective way for further structure design of thin films in EMI shielding field.


Carbon ◽  
2021 ◽  
Vol 172 ◽  
pp. 569-596
Author(s):  
Heguang Liu ◽  
Shaoqing Wu ◽  
Caiyin You ◽  
Na Tian ◽  
Yuan Li ◽  
...  

2020 ◽  
Vol 8 (47) ◽  
pp. 16930-16939
Author(s):  
Qingsong Lian ◽  
Weijie Xu ◽  
Yan Li ◽  
Hongfeng Chen ◽  
Hongji Duan ◽  
...  

Preparation of the T-ZnO/Ag/EP composites via the MISP method and their excellent EMI shielding performance and relatively high mechanical properties.


Sign in / Sign up

Export Citation Format

Share Document