Photoacoustic characterization of the mechanical properties of thin films

2002 ◽  
Vol 80 (4) ◽  
pp. 691-693 ◽  
Author(s):  
Carmen M. Hernandez ◽  
Todd W. Murray ◽  
Sridhar Krishnaswamy
2005 ◽  
Vol 277-279 ◽  
pp. 907-911
Author(s):  
Jingyu Hyeon Lee ◽  
Yi Yeol Lyu ◽  
Mong Sup Lee ◽  
Jin Heong Yim ◽  
Sang Youl Kim

Poly(methyl-co-cyclosiloxane bearing silsesquioxane)s (P(M-co-CSSQs)) were prepared. Using poly(e-caprolactone) (PCL) as a template, PCL / P(M-co-CSSQ) nanohybrid films were fabricated. The electrical, morphological, and mechanical properties of the PCL / P(M-co-CSSQ) films were investigated. The dielectric constant of a cured PCL / P(M-co-CSSQ) film at 420°C scaled down from 2.55 to 2.05 and refractive index from 1.41 to 1.33 when 20 vol. % of the PCL was admixed with the polymer matrix. The elastic modulus and hardness of the cured PCL / P(Mco- CSSQ) (2:8, vol./vol.) film were 2.50 and 0.32 GPa, respectively, showing dependency on the PCL content.


2006 ◽  
Vol 38 (12) ◽  
pp. 1182-1198 ◽  
Author(s):  
Hervé Pelletier ◽  
Joël Krier ◽  
Pierre Mille

2019 ◽  
Vol 51 (3) ◽  
pp. 277-283 ◽  
Author(s):  
Aleksandar Stajcic ◽  
Ivana Radovic ◽  
Vladan Cosovic ◽  
Aleksandar Grujic ◽  
Jasna Stajic-Trosic ◽  
...  

This study presents preparation and characterization of ethyl cellulose based nanocomposites. Successful use of simple solvent casting technique provided nanocomposites with high loads of barium ferrite magnetic nanopowder in the polymer matrix, promising significant improvement of mechanical properties. Investigation of morphology revealed formation of agglomerates that are still on nanoscopic level. Nanocomposite thin films with a higher content of the magnetic powder showed substantial enhancement of break strength, elongation and microhardness compared to the pure ethyl cellulose, which was the primary aim of this research.


Author(s):  
Warren J. Moberly ◽  
Daniel Schwarcz ◽  
Milton Ohring

Aluminum thin films have been universally employed as interconnections in integrated circuits for the last quarter of a century. However, during this time Al metallization has never been totally immune from assorted reliability problems. This present research involves preparation and characterization of “dual phase” thin films, comprised of Al (or a transition metal) vacuum evaporated onto a liquid Ga (or other low melting temperature metal) nucleant layer. Ga is well known for causing grain boundary embrittlement in structural Al alloys. However, the Ga may well enhance the mechanical properties in Al thin films used as interconnect metallization, where this “dual phase” microstructure will prevent the buildup of stress that has historically resulted in electromigration failures in semiconductor devices. In addition, the presence of a liquid nucleant layer results in thin films (up to 2 μm thick) having surface roughness of the order of the film thickness, which in turn would enhance the bondability of such films.


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