“dual phase” thin films prepared by deposition of aluminum on liquid nucleant gallium layers

1992 ◽  
Vol 50 (2) ◽  
pp. 1432-1433
Author(s):  
Warren J. Moberly ◽  
Daniel Schwarcz ◽  
Milton Ohring
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Integrated Circuits ◽  
Al Alloys ◽  
Dual Phase ◽  
Grain Boundary Embrittlement ◽  
Al Metallization ◽  
Boundary Embrittlement

Aluminum thin films have been universally employed as interconnections in integrated circuits for the last quarter of a century. However, during this time Al metallization has never been totally immune from assorted reliability problems. This present research involves preparation and characterization of “dual phase” thin films, comprised of Al (or a transition metal) vacuum evaporated onto a liquid Ga (or other low melting temperature metal) nucleant layer. Ga is well known for causing grain boundary embrittlement in structural Al alloys. However, the Ga may well enhance the mechanical properties in Al thin films used as interconnect metallization, where this “dual phase” microstructure will prevent the buildup of stress that has historically resulted in electromigration failures in semiconductor devices. In addition, the presence of a liquid nucleant layer results in thin films (up to 2 μm thick) having surface roughness of the order of the film thickness, which in turn would enhance the bondability of such films.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Texture and Nano Mechanical Properties of YSZ Electrolyte Thin Films Prepared by CCVD and PLD

2003 ◽  
Vol 778 ◽  
Author(s):  
Z. Xu ◽  
C. Waters ◽  
X. Wang ◽  
N. Sudhir ◽  
S. Yarmolenko ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Chemical Vapor ◽  
Film Deposition ◽  
Advanced Materials ◽  
State University ◽  
Composite Thin Films ◽  
Ysz Electrolyte ◽  
T State

AbstractComposite thin films of yttria stabilized zirconia (YSZ) and alumina (Al2O3) have been synthesized using liquid fuel combustion chemical vapor deposition (CCVD) and pulsed laser deposition (PLD) in the NSF Center for Advanced Materials and Smart Structures (CAMSS) at North Carolina A&T State University. With the CCVD technique, addition of alumina was realized by adding the designated amount of aluminum-organic in the reagent solution; while with PLD, doping of alumina in YSZ was accomplished by alternative ablations of an YSZ target and an alumina target. Variations in morphology, surface roughness and nano-mechanical properties of the composite thin films of Al2O3/YSZ were characterized. Crystal size of the films processed by CCVD was much larger than that processed by PLD; surface roughness follows the similar tendency. Upon high-temperature annealing, crystals in the PLD processed thin films grew up to 300 nm. The effect of Al2O3 in YSZ thin films on their nano-mechanical properties was dependent on the film deposition techniques in our research. For the films deposited by CCVD, addition of Al2O3 improved the nano hardness and elastic modulus of YSZ thin films, while a decline was observed in the mechanical properties of the films deposited by PLD.

Photoacoustic characterization of the mechanical properties of thin films

2002 ◽  
Vol 80 (4) ◽  
pp. 691-693 ◽  
Author(s):  
Carmen M. Hernandez ◽  
Todd W. Murray ◽  
Sridhar Krishnaswamy
Keyword(s):  
Thin Films ◽  
Mechanical Properties

Novel Mocvd Processes for Nanoscale Oxide Thin Films

1996 ◽  
Vol 446 ◽  
Author(s):  
Tingkai Li ◽  
Pete Zawadzkp ◽  
Richard A. Stall ◽  
Yongfei Zhu ◽  
Seshu B. Desu
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Integrated Circuits ◽  
Deposition Temperature ◽  
High Dielectric Constant ◽  
Ferroelectric Properties ◽  
Oxide Thin Films ◽  
High Quality ◽  
Step Process ◽  
High Dielectric

AbstractNanoscale oxide thin films such as Ba1‐xSrxTiO3 (BST), SrBi2Ta2O9 (SBT), and PbZr1‐xTixO3 (PZT) that have a high dielectric constant and excellent ferroelectric properties have been receiving greatly increased attention, especially for high density memories in next generation integrated circuits. However, with increasing deposition temperature the surface roughness of the films increases, which results in high leakage current, and when the thickness of oxide films is decreased, the apparent bulk‐like properties of thin films tend to worsen due to the increased influence of the interface. To solve these problems, novel MOCVD techniques, plasma enhanced deposition, and a two step process, were developed for high quality oxide thin films.

scholarly journals Ultra-thin films for plasmonics: a technology overview

2015 ◽  
Vol 4 (3) ◽  
Author(s):  
Radu Malureanu ◽  
Andrei Lavrinenko
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Support Surface ◽  
New Materials ◽  
Infra Red ◽  
Plasmon Polaritons ◽  
Plasmon Propagation ◽  
Made In

AbstractUltra-thin films with low surface roughness that support surface plasmon-polaritons in the infra-red and visible ranges are needed in order to improve the performance of devices based on the manipulation of plasmon propagation. Increasing amount of efforts is made in order not only to improve the quality of the deposited layers but also to diminish their thickness and to find new materials that could be used in this field. In this review, we consider various thin films used in the field of plasmonics and metamaterials in the visible and IR range. We focus our presentation on technological issues of their deposition and reported characterization of film plasmonic performance.

Mechanical, Electrical and Thermal Characterization of Commercially Available LTCC Dielectric Tapes

2013 ◽  
Vol 543 ◽  
pp. 212-215
Author(s):  
Goran Radosavljević ◽  
Nelu Blaž ◽  
Andrea Marić ◽  
W. Smetana ◽  
Ljiljana Živanov
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Electrical Properties ◽  
Material Characterization ◽  
Mechanical Characterization ◽  
Thermal Characterization ◽  
Material Parameters ◽  
Mechanical And Electrical Properties

Presented paper deals with mechanical and electrical properties of several commercially available LTCC (Low Temperature Co-fired Technology) tapes, as well as their thermal characterization. Three commercially available dielectric tape materials provided by Heraeus (CT700, CT707 and CT800) are investigated. The samples for determination of significant material parameters are prepared using the standard LTCC fabrication process. Results of the material characterization (chemical analysis, surface roughness electrical and mechanical properties) are presented. In addition thermo-electrical and-mechanical characterization of investigated tapes analysis is performed.

Characterization of Nanoporous Low Dielectric Polysilsesquioxane Thin Films

2005 ◽  
Vol 277-279 ◽  
pp. 907-911
Author(s):  
Jingyu Hyeon Lee ◽  
Yi Yeol Lyu ◽  
Mong Sup Lee ◽  
Jin Heong Yim ◽  
Sang Youl Kim
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Refractive Index ◽  
Elastic Modulus ◽  
Polymer Matrix ◽  
Low Dielectric

Poly(methyl-co-cyclosiloxane bearing silsesquioxane)s (P(M-co-CSSQs)) were prepared. Using poly(e-caprolactone) (PCL) as a template, PCL / P(M-co-CSSQ) nanohybrid films were fabricated. The electrical, morphological, and mechanical properties of the PCL / P(M-co-CSSQ) films were investigated. The dielectric constant of a cured PCL / P(M-co-CSSQ) film at 420°C scaled down from 2.55 to 2.05 and refractive index from 1.41 to 1.33 when 20 vol. % of the PCL was admixed with the polymer matrix. The elastic modulus and hardness of the cured PCL / P(Mco- CSSQ) (2:8, vol./vol.) film were 2.50 and 0.32 GPa, respectively, showing dependency on the PCL content.

Sign in / Sign up

Export Citation Format

Share Document