FORENSIC EXAMINATION USING A NONDESTRUCTIVE EVALUATION METHOD FOR SURFACE METROLOGY

2009 ◽  
Author(s):  
David J. Eisenmann ◽  
L. Scott Chumbley ◽  
Donald O. Thompson ◽  
Dale E. Chimenti
Keyword(s):  
Nondestructive Evaluation ◽  
Evaluation Method ◽  
Surface Metrology ◽  
Forensic Examination

Numerical analysis of an electromagnetic nondestructive evaluation method for rotating machinery

2010 ◽  
Vol 33 (3-4) ◽  
pp. 1101-1107
Author(s):  
Haoyu Huang ◽  
Ryo Kayata ◽  
Stephane Perrin ◽  
Noritaka Yusa ◽  
Kenzo Miya
Keyword(s):  
Numerical Analysis ◽  
Nondestructive Evaluation ◽  
Evaluation Method ◽  
Rotating Machinery

A new method for M-integral experimental evaluation

2012 ◽  
Vol 22 (2) ◽  
pp. 238-246 ◽  
Author(s):  
Hong Zuo ◽  
Yu-hong Feng
Keyword(s):  
Stress Distribution ◽  
Nondestructive Evaluation ◽  
Experimental Measurement ◽  
Measurement Method ◽  
Evaluation Method ◽  
Specimen Geometry ◽  
Related Integral ◽  
Integral Contour ◽  
M Integral ◽  
Distribution Assumption

In this article, the experimental measurement method of M-integral is investigated. Through the detailed analysis to the nondestructive evaluation method of J- and M-integrals suggested by King and Herrmann, it is found that the specimen geometry which they selected and the corresponding clamping mode in their test exists a conflict with the stress distribution assumption on the integral contour. The formulas they proposed cannot represent the selected specimen geometry and the related integral contours. To avoid this conflict, a new experimental measurement method and a simper specimen style is proposed in this study. According to the method, the M-integral is nondestructive evaluated experimentally through the new specimen and the new clamping mode.

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

2005 ◽  
Author(s):  
Yuhki Sato ◽  
Hideo Miura
Keyword(s):  
Nondestructive Evaluation ◽  
Flip Chip ◽  
Evaluation Method ◽  
Local Deformation ◽  
Blue Laser ◽  
Inspection Method ◽  
Bonding Structure ◽  
Small Change ◽  
Non Destructive ◽  
Adhesion Condition

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.

A Study on the Nondestructive Evaluation Method for Detecting Void in Containment Liner Plate

2020 ◽  
Vol 40 (6) ◽  
pp. 389-396
Author(s):  
Yeong-Won Choi ◽  
Yun-Taek Yeom ◽  
Hak-Joon Kim ◽  
Sung-Jin Song ◽  
Sung-Woo Ryu ◽  
...  
Keyword(s):  
Nondestructive Evaluation ◽  
Evaluation Method

scholarly journals The study of nondestructive evaluation method of paper records materials by NIR spectroscopy

2010 ◽  
Vol 23 (3) ◽  
pp. 304-311 ◽  
Author(s):  
Yoon-Hee Han ◽  
Yong-Min Shin ◽  
Soung-Be Park ◽  
Sung-Un Nam ◽  
Hyo-Jin Kim
Keyword(s):  
Nondestructive Evaluation ◽  
Evaluation Method ◽  
Nir Spectroscopy
Sign in / Sign up

Export Citation Format

Share Document