A new method for M-integral experimental evaluation

2012 ◽  
Vol 22 (2) ◽  
pp. 238-246 ◽  
Author(s):  
Hong Zuo ◽  
Yu-hong Feng

In this article, the experimental measurement method of M-integral is investigated. Through the detailed analysis to the nondestructive evaluation method of J- and M-integrals suggested by King and Herrmann, it is found that the specimen geometry which they selected and the corresponding clamping mode in their test exists a conflict with the stress distribution assumption on the integral contour. The formulas they proposed cannot represent the selected specimen geometry and the related integral contours. To avoid this conflict, a new experimental measurement method and a simper specimen style is proposed in this study. According to the method, the M-integral is nondestructive evaluated experimentally through the new specimen and the new clamping mode.

2010 ◽  
Vol 33 (3-4) ◽  
pp. 1101-1107
Author(s):  
Haoyu Huang ◽  
Ryo Kayata ◽  
Stephane Perrin ◽  
Noritaka Yusa ◽  
Kenzo Miya

2009 ◽  
Vol 76 (6) ◽  
Author(s):  
Hu Yi-Feng ◽  
Chen Yi-Heng

In this paper we extend the M-integral concept (Eshelby, J. D., 1956, The Continuum Theory of Lattice Defects, Solid State Physics, F. Seitz and D. Turnbull, eds., Academic, New York, pp. 79–141; Eshelby, J. D., 1970, The Energy Momentum Tensor in Continuum Mechanics, Inelastic Behavior of Solids, M. F. Kanninen, ed., McGraw-Hill, New York, pp. 77–115; Eshelby, J. D., 1975, “The Elastic Energy-Momentum Tensor,” J. Elast., 5, pp. 321–335; Knowles, J. K., and Sternberg, E., 1972, “On a Class of Conservation Laws in Linearized and Finite Elastostatics,” Arch. Ration. Mech. Anal., 44, pp. 187–211; Budiansky, B., and Rice, J. R., 1973, “Conservation Laws and Energy Release Rates,” ASME J. Appl. Mech., 40, pp. 201–203; Freund, L. B., 1978, “Stress Intensity Factor Calculations Based on a Conservation Integral,” Int. J. Solids Struct., 14, pp. 241–250; Herrmann, G. A., and Herrmann, G., 1981, “On Energy Release Rates for a Plane Cracks,” ASME J. Appl. Mech., 48, pp. 525–530; King, R. B., and Herrmann, G., 1981, “Nondestructive Evaluation of the J- and M-Integrals,” ASME J. Appl. Mech., 48, pp. 83–87) to study the degradation of a brittle plan strip caused by irreversible evolution: the cracks coalescence under monotonically increasing loading. Attention is focused on the change of the M-integral before and after coalescence of two neighborly located cracks inclined each other. The influences of different orientations of the two cracks and different coalescence paths connecting the two cracks on the M-integral are studied in detail. Finite element analyses reveal that different orientations of the two cracks lead to different critical values of the M-integral at which the coalescence occurs. It is concluded that the M-integral does play an important role in the description of the damage extent and damage evolution. However, it only provides some outside variable features. This means that the complete failure mechanism due to damage evolution cannot be governed by a single parameter MC as proposed by Chang and Peng, 2004, “Use of M integral for Rubbery Material Problems Containing Multiple Defects,” J. Eng. Mech., 130(5), pp. 589–598. It is found that there is an inherent relation between the M-integral and the reduction of the effective elastic moduli as the orientation of one crack varies, i.e., the larger the M-integral is, the larger the reduction is. Of great significance is that the M-integral is inherently related to the change of the total potential energy for a damaged brittle material regardless of the detailed damage features or damage evolution. Therefore, this provides a useful and convenient experimental technique to measure the values of M-integral for a damaged brittle material from initial damage to final failure without use of many stain gages (King, R. B., and Herrmann, G., 1981, “Nondestructive Evaluation of the J- and M-Integrals,” ASME J. Appl. Mech., 48, pp. 83–87).


2009 ◽  
Author(s):  
David J. Eisenmann ◽  
L. Scott Chumbley ◽  
Donald O. Thompson ◽  
Dale E. Chimenti

Author(s):  
Yuhki Sato ◽  
Hideo Miura

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.


Sign in / Sign up

Export Citation Format

Share Document