Numerical analysis of an electromagnetic nondestructive evaluation method for rotating machinery

2010 ◽  
Vol 33 (3-4) ◽  
pp. 1101-1107
Author(s):  
Haoyu Huang ◽  
Ryo Kayata ◽  
Stephane Perrin ◽  
Noritaka Yusa ◽  
Kenzo Miya
2013 ◽  
Vol 470 ◽  
pp. 683-688
Author(s):  
Hai Yang Jiang ◽  
Hua Qing Wang ◽  
Peng Chen

This paper proposes a novel fault diagnosis method for rotating machinery based on symptom parameters and Bayesian Network. Non-dimensional symptom parameters in frequency domain calculated from vibration signals are defined for reflecting the features of vibration signals. In addition, sensitive evaluation method for selecting good non-dimensional symptom parameters using the method of discrimination index is also proposed for detecting and distinguishing faults in rotating machinery. Finally, the application example of diagnosis for a roller bearing by Bayesian Network is given. Diagnosis results show the methods proposed in this paper are effective.


2022 ◽  
Vol 12 (2) ◽  
pp. 858
Author(s):  
Kentaro Imai ◽  
Takashi Hashimoto ◽  
Yuta Mitobe ◽  
Tatsuo Masuta ◽  
Narumi Takahashi ◽  
...  

Tsunami-related fires may occur in the inundation area during a huge tsunami disaster, and woody debris produced by the tsunami can cause the fires to spread. To establish a practical method for evaluating tsunami-related fire predictions, we previously developed a method for evaluating the tsunami debris thickness distribution that uses tsunami computation results and static parameters for tsunami numerical analysis. We then used this evaluation method to successfully reproduce the tsunami debris accumulation trend. We then developed an empirical building fragility function that relates the production of debris not only to inundation depth but also to the topographic gradient and the proportion of robust buildings. Using these empirical evaluation models, along with conventional tsunami numerical analysis data, we carried out a practical tsunami debris prediction for Owase City, Mie Prefecture, a potential disaster area for a Nankai Trough mega-earthquake. This prediction analysis method can reveal hazards which go undetected by a conventional tsunami inundation analysis. These results indicate that it is insufficient to characterize the tsunami hazard by inundation area and inundation depth alone when predicting the hazard of a huge tsunami; moreover, more practically, it is necessary to predict the hazard based on the effect of tsunami debris.


2009 ◽  
Author(s):  
David J. Eisenmann ◽  
L. Scott Chumbley ◽  
Donald O. Thompson ◽  
Dale E. Chimenti

2012 ◽  
Vol 22 (2) ◽  
pp. 238-246 ◽  
Author(s):  
Hong Zuo ◽  
Yu-hong Feng

In this article, the experimental measurement method of M-integral is investigated. Through the detailed analysis to the nondestructive evaluation method of J- and M-integrals suggested by King and Herrmann, it is found that the specimen geometry which they selected and the corresponding clamping mode in their test exists a conflict with the stress distribution assumption on the integral contour. The formulas they proposed cannot represent the selected specimen geometry and the related integral contours. To avoid this conflict, a new experimental measurement method and a simper specimen style is proposed in this study. According to the method, the M-integral is nondestructive evaluated experimentally through the new specimen and the new clamping mode.


Author(s):  
Yuhki Sato ◽  
Hideo Miura

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.


2020 ◽  
Vol 40 (6) ◽  
pp. 389-396
Author(s):  
Yeong-Won Choi ◽  
Yun-Taek Yeom ◽  
Hak-Joon Kim ◽  
Sung-Jin Song ◽  
Sung-Woo Ryu ◽  
...  

2004 ◽  
Vol 2004 (0) ◽  
pp. 137-138
Author(s):  
Takashi UEDA ◽  
Masahiro TAKANASHI ◽  
Fumio TAKEMASA ◽  
Hiroshi OHYA

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