Effect of post deposition anneal on the characteristics of HfO2/InP metal-oxide-semiconductor capacitors

2011 ◽  
Vol 99 (17) ◽  
pp. 172901 ◽  
Author(s):  
R. V. Galatage ◽  
H. Dong ◽  
D. M. Zhernokletov ◽  
B. Brennan ◽  
C. L. Hinkle ◽  
...  
2018 ◽  
Vol 139 ◽  
pp. 115-120 ◽  
Author(s):  
Suhyeong Lee ◽  
Young Seok Kim ◽  
Hong Jeon Kang ◽  
Hyunwoo Kim ◽  
Min-Woo Ha ◽  
...  

2016 ◽  
Vol 858 ◽  
pp. 1178-1181
Author(s):  
Patrick Fiorenza ◽  
Giuseppe Greco ◽  
Ferdinando Iucolano ◽  
Antonino Parisi ◽  
Santo Reina ◽  
...  

In this work, the different nature of trapping states in metal-oxide-semiconductor (MOS) capacitors fabricated on recessed AlGaN/GaN heterostructures has been investigated. In particular, the origin of both fast and slow states has been elucidated by frequency dependent conductance measurements. Using post deposition annealing in forming gas, which is known to induce hydrogen incorporation at the interface, allowed to ascribe the fast traps (with characteristic response time in the range of 5–50 μs) to SiO2/GaN interface states and the slow traps (50–100 μs) to “border traps” located few nanometers inside the SiO2 layer. The results can be useful to predict the behavior of GaN switching devices, like hybrid MOSHEMTs.


2003 ◽  
Vol 82 (11) ◽  
pp. 1757-1759 ◽  
Author(s):  
Mohammad Shahariar Akbar ◽  
S. Gopalan ◽  
H.-J. Cho ◽  
K. Onishi ◽  
R. Choi ◽  
...  

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