Study of the CeO2/HfO2/InAs metal-oxide-semiconductor capacitors with different post-deposition-annealing temperatures

2010 ◽  
Author(s):  
T. E. Shie ◽  
C. H. Chang ◽  
Y. C. Lin ◽  
K. Kakushima ◽  
H. Iwai ◽  
...  
2018 ◽  
Vol 139 ◽  
pp. 115-120 ◽  
Author(s):  
Suhyeong Lee ◽  
Young Seok Kim ◽  
Hong Jeon Kang ◽  
Hyunwoo Kim ◽  
Min-Woo Ha ◽  
...  

2016 ◽  
Vol 858 ◽  
pp. 1178-1181
Author(s):  
Patrick Fiorenza ◽  
Giuseppe Greco ◽  
Ferdinando Iucolano ◽  
Antonino Parisi ◽  
Santo Reina ◽  
...  

In this work, the different nature of trapping states in metal-oxide-semiconductor (MOS) capacitors fabricated on recessed AlGaN/GaN heterostructures has been investigated. In particular, the origin of both fast and slow states has been elucidated by frequency dependent conductance measurements. Using post deposition annealing in forming gas, which is known to induce hydrogen incorporation at the interface, allowed to ascribe the fast traps (with characteristic response time in the range of 5–50 μs) to SiO2/GaN interface states and the slow traps (50–100 μs) to “border traps” located few nanometers inside the SiO2 layer. The results can be useful to predict the behavior of GaN switching devices, like hybrid MOSHEMTs.


2011 ◽  
Vol 470 ◽  
pp. 79-84
Author(s):  
Hai Gui Yang ◽  
Masatoshi Iyota ◽  
Shogo Ikeura ◽  
Dong Wang ◽  
Hiroshi Nakashima

Al2O3 deposition and subsequent post-deposition annealing (Al2O3-PDA) is proposed as an effective method to passivate electrically active defects in Ge-rich SiGe-on-insulator (SGOI) substrates. We found that Al2O3-PDA could not only suppress the surface reaction during Al-PDA, but could also effectively reduce the defect-induced acceptor and hole concentration in Ge-rich SGOI. Al2O3-PDA greatly improves the electrical characteristics of a back-gate metal-oxide-semiconductor field-effect transistor fabricated on Ge-rich SGOI.


2003 ◽  
Vol 82 (11) ◽  
pp. 1757-1759 ◽  
Author(s):  
Mohammad Shahariar Akbar ◽  
S. Gopalan ◽  
H.-J. Cho ◽  
K. Onishi ◽  
R. Choi ◽  
...  

2016 ◽  
Vol 858 ◽  
pp. 659-662 ◽  
Author(s):  
Marilena Vivona ◽  
Patrick Fiorenza ◽  
Salvatore di Franco ◽  
Claude Marcandella ◽  
Marc Gaillardin ◽  
...  

The overall radiation response to X-ray exposure of metal-oxide-semiconductor (MOS) capacitors, subjected to two different post-deposition-annealing (PDA) processes in N2O or POCl3 atmospheres, was investigated by capacitance-voltage (C-V) analyses. The production rate and saturation density of electrically active defects, different for the two oxides, demonstrated an additional contribution to the defects formation coming from the annealing treatements. The higher susceptibility of the POCl3-annealed oxide respect to the N2O annealed is discussed.


2011 ◽  
Vol 99 (17) ◽  
pp. 172901 ◽  
Author(s):  
R. V. Galatage ◽  
H. Dong ◽  
D. M. Zhernokletov ◽  
B. Brennan ◽  
C. L. Hinkle ◽  
...  

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