Investigation of interfacial reaction product of SiCf/C/Mo/Ti6Al4V composite through Raman spectroscopy

2014 ◽  
Vol 104 (8) ◽  
pp. 081611 ◽  
Author(s):  
Zhiyuan Xiao ◽  
Yanqing Yang ◽  
Xian Luo ◽  
Bin Huang
Keyword(s):  
Raman Spectroscopy ◽  
Interfacial Reaction ◽  
Interfacial Reaction Product

Raman Investigation of Interfacial Reaction Product of SiCf /Ti43Al9V Composite

2015 ◽  
Vol 98 (6) ◽  
pp. 1937-1941 ◽  
Author(s):  
Zhiyuan Xiao ◽  
Yanqing Yang ◽  
Xian Luo ◽  
Bin Huang
Keyword(s):  
Interfacial Reaction ◽  
Interfacial Reaction Product

Study on Microstructure of Continuous Cf/Al Composite Material Prepared by Hot Pressing Diffusion Method

2014 ◽  
Vol 941-944 ◽  
pp. 245-250 ◽  
Author(s):  
Bai Ping Lu ◽  
Xing Feng Liu ◽  
Tian Tian Shuai
Keyword(s):  
Composite Material ◽  
Interfacial Reaction ◽  
Aluminum Powder ◽  
Hot Pressing ◽  
Aluminum Foil ◽  
Pressing Temperature ◽  
Material Density ◽  
Pressing Time ◽  
Interfacial Reaction Product ◽  
Al Composite

Two-dimensional carbon fiber fabric T300 used as reinforcement, Cf/Al composite material was prepared by hot pressing diffusion. Effect of parameters on microstructure of Cf/Al composite material was studied. We found that for aluminum foil used as matrix, hot pressing temperature is 650°C, hot pressing time is 20min, pressure is 30MPa. As a case, interfacial reaction product Al4C3 accounts for 3.6%, and composite material density is 2.44g/cm3. For aluminum powder used as matrix, hot pressing temperature is 620°C, hot pressing time is 35min, pressure is 10MPa. As a case, Al4C3 accounts for 2.8%, and composite material density is 2.58g/cm3. The molding of aluminum powder is much easier than that of aluminum foil. The latter requires higher hot pressing temperature. Interfacial reaction product Al4C3 increases as increasing of hot pressing temperature and pressure.

Study on the interfacial reaction product in Gr/A1 composites

1996 ◽  
Vol 5 (2) ◽  
pp. 119-128 ◽  
Author(s):  
Mingyuan Gu ◽  
Haining Yang ◽  
Weijie Jiang ◽  
Guoding Zhang
Keyword(s):  
Interfacial Reaction ◽  
Interfacial Reaction Product

Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples

2006 ◽  
Vol 21 (7) ◽  
pp. 1849-1856 ◽  
Author(s):  
Chin-yi Chou ◽  
Sinn-wen Chen ◽  
Yee-shyi Chang
Keyword(s):  
Reaction Time ◽  
Melting Point ◽  
Oxidation Resistance ◽  
Interfacial Reaction ◽  
Interfacial Reactions ◽  
Reaction Products ◽  
Phase Layer ◽  
Cu Content ◽  
Wetting Properties ◽  
Interfacial Reaction Product

Sn–Zn-based alloys are promising low melting-point Pb-free solders, and it has been reported that their wetting properties and oxidation resistance can be improved with the addition of Cu. The interfacial reactions in the Sn–9 wt% Zn–xCu/Cu couples at 250 °C and Sn–9 wt% Zn–xCu/Ni at 280 °C were examined in this study. A thick γ–Cu5Zn8 phase layer and a very thin β′–CuZn phase layer were formed in both the Sn–9 wt% Zn/Cu and the Sn–9 wt% Zn–1 wt% Cu/Cu couples. The γ–Ni5Zn21 phase layer was formed in both the Sn–9 wt% Zn/Ni and Sn–9 wt% Zn–1 wt% Cu/Ni couples. With longer reaction time, the δ–Ni3Sn4 phase were formed in the Sn–9 wt% Zn/Ni couple as well. In both the Cu and Ni couples, the Zn-containing γ phases were uniform and planar and were the dominant reaction products. However, when the Cu content of the Sn–9 wt% Zn–xCu solders was 10 wt%, the interfacial reaction product becomes the η–Cu6Sn5 phase in both the Cu and Ni couples.

Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding

1992 ◽  
Vol 27 (8) ◽  
pp. 2061-2066 ◽  
Author(s):  
Sung Tae Kim ◽  
Chong Hee Kim
Keyword(s):  
Interfacial Reaction ◽  
Eutectic Bonding ◽  
Interfacial Reaction Product

Study of Ge Out-diffusion During Nickel (Platinum ∼ 0, 5, 10 at.%) Germanosilicide Formation

2004 ◽  
Vol 810 ◽  
Author(s):  
L. J. Jin ◽  
K. L. Pey ◽  
W. K. Choi ◽  
E. A. Fitzgerald ◽  
D. A. Antoniadis ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Interfacial Reaction ◽  
Rapid Thermal Annealing ◽  
Annealing Temperature ◽  
Diffraction Method ◽  
X Ray Diffraction ◽  
X Ray ◽  
Micro Raman Spectroscopy ◽  
Higher Temperature ◽  
Nickel Platinum

ABSTRACTThe interfacial reaction between 10 nm Ni(Pt ∼0, 5, 10 at.%) and (100) Si0.75Ge0.25 substrate after rapid thermal annealing between 400 and 800°C has been studied in detail using Micro- Raman spectroscopy. Only monogermanosilicide phase was detected in the temperature range investigated. The evolution of a broad Ni(Pt)SiGe Raman peak into two distinct peaks with increasing annealing temperature is attributed to a Ge out-diffusion from the germanosilicide grains. In addition, Raman spectroscopy further proves that depletion of Ge concentration in the Ni(Pt)SiGe grains reduces at higher temperature by the addition of Pt. The above phenomena were further supported by X-ray diffraction method.

Use of spontaneous Raman spectroscopy as a diagnostic of silica-particle-laden flames

1990 ◽  
Vol 87 ◽  
pp. 301-312
Author(s):  
I Souche
Keyword(s):  
Raman Spectroscopy ◽  
Silica Particle

Confocal observation of individual classes of single wall nanotubes by surface-enhanced Raman spectroscopy

2000 ◽  
Vol 10 (PR8) ◽  
pp. Pr8-223 ◽  
Author(s):  
J. Azoulay ◽  
A. Débarre ◽  
A. Richard ◽  
P. Tchénio
Keyword(s):  
Raman Spectroscopy ◽  
Surface Enhanced Raman Spectroscopy ◽  
Surface Enhanced ◽  
Surface Enhanced Raman ◽  
Single Wall Nanotubes
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