Study on Microstructure of Continuous Cf/Al Composite Material Prepared by Hot Pressing Diffusion Method

Two-dimensional carbon fiber fabric T300 used as reinforcement, Cf/Al composite material was prepared by hot pressing diffusion. Effect of parameters on microstructure of Cf/Al composite material was studied. We found that for aluminum foil used as matrix, hot pressing temperature is 650°C, hot pressing time is 20min, pressure is 30MPa. As a case, interfacial reaction product Al4C3 accounts for 3.6%, and composite material density is 2.44g/cm3. For aluminum powder used as matrix, hot pressing temperature is 620°C, hot pressing time is 35min, pressure is 10MPa. As a case, Al4C3 accounts for 2.8%, and composite material density is 2.58g/cm3. The molding of aluminum powder is much easier than that of aluminum foil. The latter requires higher hot pressing temperature. Interfacial reaction product Al4C3 increases as increasing of hot pressing temperature and pressure.

Effect of Ti Addition on Shear Strength of Brazing Diamond and Ag Based Filler Alloy

The shear strength samples of brazed single crystal diamond with the (72Ag–28Cu)–xTi (x=2, 4, 7wt.%) active filler metal were prepared, using vacuum brazing methods. Microstructure evolution of interfacial reaction product and shear strength of the brazed diamond and Ag based filler alloy were studied. The results show that there exits a layer of TiC on the surface diamond in different Ti additions, and the thickness of TiC layer increases with the increase of Ti addition. With the increase of Ti addition, the shear strength of the brazed joint decreases due to the increase of TiC layer thickness and amount of intermetallics. From the results, it was seen that mutual diffusion of C and Ti was effective on the morphology of the interface zone that affected the shear strength of the bonds. To achieve a reliable brazed joint, the Ti content must be controlled under 4wt.%.

AlN nanowires for Al-based composites with high strength and low thermal expansion

Based on the synthesis of a sufficient amount of AlN nanowires (AlN-NWs), AlN-NWs/Al composites with homogenously distributed AlN-NWs were fabricated. Microstructural observations reveal that the interface between AlN-NWs and Al matrix is clean and bonded well, and no interfacial reaction product was formed at the nanowire-matrix boundary. Mechanical properties including yield and tensile strength of the composites were improved with AlN-NWs volume fraction changing from 5 to 15 vol%, and the maximum yield and tensile strengths of the composite were about 6 and 5 times, respectively, as high as those of Al matrix. Meanwhile, AlN-NWs effectively decreased the coefficient of thermal expansion (CTE) of the composites, and the CTE of 15 vol% composite was about one half that of Al matrix. The results obtained suggest that AlN nanowire is a promising reinforcement for optimizing the mechanical and thermal properties of metal matrix composites.

Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples

Sn–Zn-based alloys are promising low melting-point Pb-free solders, and it has been reported that their wetting properties and oxidation resistance can be improved with the addition of Cu. The interfacial reactions in the Sn–9 wt% Zn–xCu/Cu couples at 250 °C and Sn–9 wt% Zn–xCu/Ni at 280 °C were examined in this study. A thick γ–Cu5Zn8 phase layer and a very thin β′–CuZn phase layer were formed in both the Sn–9 wt% Zn/Cu and the Sn–9 wt% Zn–1 wt% Cu/Cu couples. The γ–Ni5Zn21 phase layer was formed in both the Sn–9 wt% Zn/Ni and Sn–9 wt% Zn–1 wt% Cu/Ni couples. With longer reaction time, the δ–Ni3Sn4 phase were formed in the Sn–9 wt% Zn/Ni couple as well. In both the Cu and Ni couples, the Zn-containing γ phases were uniform and planar and were the dominant reaction products. However, when the Cu content of the Sn–9 wt% Zn–xCu solders was 10 wt%, the interfacial reaction product becomes the η–Cu6Sn5 phase in both the Cu and Ni couples.