Very high transconductance InGaAs/InP junction field‐effect transistor with submicrometer gate

1987 ◽  
Vol 50 (9) ◽  
pp. 535-536 ◽  
Author(s):  
J. Y. Raulin ◽  
E. Thorngren ◽  
M. A. di Forte‐Poisson ◽  
M. Razeghi ◽  
G. Colomer
1987 ◽  
Vol 23 (2) ◽  
pp. 77 ◽  
Author(s):  
G.W. Taylor ◽  
M.S. Lebby ◽  
T.Y. Chang ◽  
R.N. Gnall ◽  
N. Sauer ◽  
...  

1995 ◽  
Vol 31 (8) ◽  
pp. 680 ◽  
Author(s):  
M. Arafa ◽  
K. Ismail ◽  
P. Fay ◽  
J.O. Chu ◽  
B.S. Meyerson ◽  
...  

2007 ◽  
Vol 556-557 ◽  
pp. 975-978
Author(s):  
Kent Bertilsson ◽  
Chris I. Harris

Both unipolar and injection SiC devices can be used for high voltage switching applications; it is not determined, however, for which applications one approach is preferred over the other. In this paper, simulation studies are used to compare the suitability of unipolar devices, in this case a JFET (Junction Field Effect Transistor) against an equivalent FCD (Field Controlled Diode) configuration up to very high voltages. The calculations are performed in a finite element approach, with commercial drift-diffusion software. Numerous drift layers have been simulated in a Monte-Carlo approach to ensure that the optimal design of the drift layers for different breakdown is used. In a static case, purely conductive losses in the drift layer in both unipolar and injection configuration are compared. Additionally the total losses are studied and compared in switched applications for different switching frequencies and current levels.


2018 ◽  
Vol 67 (6) ◽  
pp. 068101
Author(s):  
Zhang Jin-Feng ◽  
Yang Peng-Zhi ◽  
Ren Ze-Yang ◽  
Zhang Jin-Cheng ◽  
Xu Sheng-Rui ◽  
...  

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