Research on Performance of Epoxy Electronic Packaging Materials

2013 ◽  
Vol 668 ◽  
pp. 226-230
Author(s):  
Hao Ran Zhou ◽  
An Sun ◽  
Hao Cheng Yang ◽  
Shuang Zhao
Keyword(s):  
Epoxy Resin ◽  
Electronic Packaging ◽  
Volume Resistivity ◽  
Mechanical Analysis ◽  
Electrical Performance ◽  
Process Conditions ◽  
Packaging Materials ◽  
Curing Process ◽  
Matrix Resin ◽  
Ft Ir

This article the epoxy resin electronic packaging materials was prepared via epoxy resin E-51 as matrix resin, MNA for curing agent, the CTBN as toughening agents, BPO, DMP-30, Al(MM)3, 2E4MZ as curing promoting agents by mechanical blending. The cured condition was 80°C curing 2 h, 90°C curing 2 h, 100°C curing 5 h. The structure of the epoxy resin electronic packaging materials was characterized via FT-IR, the result showed that epoxy resin cured completely. Dynamic mechanical analysis (DMA) is evaluated material thermal stability. The results show that anhydride dosage 7.7 g. The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis. The results show that epoxy electronic potting having BPO (0.2 g) and DMP-30 (0.1 g) had electrical optimal performance. In the curing process conditions, its performance is meet potting requirements, curing process is feasible.

Research on Performance of Flame-Retardant Epoxy Resin Electronic Packaging Materials

2013 ◽  
Vol 763 ◽  
pp. 117-120 ◽  
Author(s):  
Hao Ran Zhou ◽  
Shuang Zhao ◽  
Wei Miao Yu ◽  
Hao Jiang ◽  
Cui Guo ◽  
...  
Keyword(s):  
Flame Retardant ◽  
Electronic Packaging ◽  
Packaging Materials ◽  
Curing Agent ◽  
Tensile Shear ◽  
Matrix Resin ◽  
Diphenyl Sulfone ◽  
Catalyst Dosage ◽  
Diamino Diphenyl Sulfone ◽  
Toughening Agent

In this article, a new flame-retardant epoxy electronic packaging materials was synthesized through the reaction of matrix resin (E-51), flame retardant (neopentyl glycol phosphate melamine sale, NPM), toughening agent (nitrile rubber, CTBN), curing agent (4, 4-diamino diphenyl sulfone, DDS) and curing catalyst (dosage of benzoyl peroxide, BPO). The results showed that: when the flame retardant was added in an amount of 5wt%, ultimate index (LOI) value of the EPNPM system was increased 2 than that of the EPAl (OH)3 system. When the NPM was added in an amount of 5wt%, the tensile shear strength of the composite was increased 18.27% than that of pure composite. Consequently, the EPNPM system prepared showed betterflame retardance and the mechanical properties.

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

2014 ◽  
Vol 936 ◽  
pp. 63-66 ◽  
Author(s):  
Chun Hua Han ◽  
Lin Wang ◽  
Dong Yu Zhao
Keyword(s):  
Epoxy Resin ◽  
Room Temperature ◽  
Curing Agent ◽  
Curing Process ◽  
Curing Conditions ◽  
Temperature Spectra ◽  
Infrared Spectral ◽  
Ft Ir ◽  
Ir Analysis ◽  
Epoxy Groups

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

A dynamic DSC study of the curing process of epoxy resin

1997 ◽  
Vol 49 (1) ◽  
pp. 123-129 ◽  
Author(s):  
Susumu Tatsumiya ◽  
Katsumasa Yokokawa ◽  
Kyosuke Miki
Keyword(s):  
Epoxy Resin ◽  
Curing Process

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

Micro-Injection Molding of Polymer Nanocomposites Composition-Process-Properties Relationship

2021 ◽  
Vol 36 (3) ◽  
pp. 276-286
Author(s):  
Z. Dekel ◽  
S. Kenig
Keyword(s):  
Mechanical Properties ◽  
Plug Flow ◽  
Volume Resistivity ◽  
Process Conditions ◽  
Polyamide 66 ◽  
Fountain Flow ◽  
Microinjection Molding ◽  
Injection Molded ◽  
Composition Process ◽  
Rheological Percolation

Abstract The mechanical, electrical, thermal, and rheological properties of micro injection molded nanocomposites comprising 2% and 5% carbon nanotubes (CNTs) incorporated in polycarbonate (PC), and polyamide 66 (PA) were studied. The design of experiments method was used to investigate the composition-process – properties relationship. Results indicated that the process variables significantly affected the flow patterns and resulting morphology during the filling stage of the microinjection molding (lIM) process, using 0.45 mm diameter lIM samples. Two distinct flow regimes have been identified in lIM using the low cross-section samples. The first was a conventional “fountain flow,” which resulted in a skin/core structure and reduced volume resistivity up to 10 X cm in the case of 5% CNTs and up to 100 X cm in 2% CNTs, in both polymers, respectively. In addition, inferior mechanical properties were obtained, attributed to polymer degradation under high shear rate conditions, when practicing high injection speeds, high mold temperatures, and high screw rotation velocities. The second was a “plug flow” due to wall slippage, obtained under low injection speeds, low mold temperatures, and low rotation velocities, leading to a substantial increase in modulus of elasticity (60%) with increased electrical resistivity up to 103 X cm for 5% CNTs and 105 X cm for 2% CNTs, respectively. The rheological percolation threshold was obtained at 2% CNTs while the electrical threshold was attained at 0.4% CNTs, in both polymers. It was concluded that in lIM, the process conditions should be closely monitored. In the case of high viscous heating, degradation of mechanical properties was obtained, while skin- core morphology formation enhanced electrical conductivity.

scholarly journals Preparation, Thermal, and Thermo-Mechanical Characterization of Polymeric Blends Based on Di(meth)acrylate Monomers

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 878
Author(s):  
Krystyna Wnuczek ◽  
Andrzej Puszka ◽  
Łukasz Klapiszewski ◽  
Beata Podkościelna
Keyword(s):  
Mechanical Analysis ◽  
Attenuated Total Reflection ◽  
Scanning Calorimetry ◽  
Force Microscopy ◽  
Chemical Structures ◽  
Atomic Force ◽  
Polymeric Blends ◽  
Ft Ir ◽  
Acrylate Monomers ◽  
Synthesized Materials

This study presents the preparation and the thermo-mechanical characteristics of polymeric blends based on di(meth)acrylates monomers. Bisphenol A glycerolate diacrylate (BPA.GDA) or ethylene glycol dimethacrylate (EGDMA) were used as crosslinking monomers. Methyl methacrylate (MMA) was used as an active solvent in both copolymerization approaches. Commercial polycarbonate (PC) was used as a modifying soluble additive. The preparation of blends and method of polymerization by using UV initiator (Irqacure® 651) was proposed. Two parallel sets of MMA-based materials were obtained. The first included more harmless linear hydrocarbons (EGDMA + MMA), whereas the second included the usually used aromatic copolymers (BPA.GDA + MMA). The influence of different amounts of PC on the physicochemical properties was discussed in detail. Chemical structures of the copolymers were confirmed by attenuated total reflection–Fourier transform infrared (ATR/FT-IR) spectroscopy. Thermo-mechanical properties of the synthesized materials were investigated by means of differential scanning calorimetry (DSC), thermogravimetric (TG/DTG) analyses, and dynamic mechanical analysis (DMA). The hardness of the obtained materials was also tested. In order to evaluate the surface of the materials, their images were obtained with the use of atomic force microscopy (AFM).

Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane

2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Thermal Polymerization ◽  
Curing Process ◽  
Thermal Stabilities ◽  
Curing Reaction ◽  
Air Atmosphere ◽  
Ft Ir ◽  
Dsc Analyses

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.

Studies on Thermal Property of Silica Aerogel/Epoxy Composite

2007 ◽  
Vol 546-549 ◽  
pp. 1581-1584 ◽  
Author(s):  
Jiu Peng Zhao ◽  
Deng Teng Ge ◽  
Sai Lei Zhang ◽  
Xi Long Wei
Keyword(s):  
Thermal Conductivity ◽  
Thermal Property ◽  
Epoxy Resin ◽  
Silica Aerogel ◽  
Epoxy Composite ◽  
Transfer Model ◽  
Insulation Material ◽  
Thermal Transfer ◽  
Heat Distortion Temperature ◽  
Ft Ir

Silica aerogel/epoxy composite, a kind of efficient thermal insulation material, was prepared by doping silica aerogel of different sizes into epoxy resin through thermocuring process. The results of thermal experiments showed that silica aerogel/epoxy composite had a lower thermal conductivity (0.105W/(m·k) at 60 wt% silica aerogel) and higher serviceability temperature (Martens heat distortion temperature: 160°C at 20 wt% silica aerogel). In addition, the composite doping larger size (0.2-2mm) of silica aerogel particle had lower thermal conductivity and higher Martens heat distortion temperature. Based on the results of SEM and FT-IR, the thermal transfer model was established. Thermal transfer mechanism and the reasons of higher Martens heat distortion temperature have been discussed respectively.

Sign in / Sign up

Export Citation Format

Share Document