An accurate CMOS interface small capacitance variation sensing circuit for capacitive MEMS sensor applications

2016 ◽  
Author(s):  
H. G. Ghasemzadeh Momen ◽  
M. Yazgi ◽  
R. Kopru ◽  
A. Naderi Saatlo
Keyword(s):  
Sensor Applications ◽  
Mems Sensor ◽  
Small Capacitance ◽  
Capacitance Variation ◽  
Capacitive Mems

Rapid Silicon-to-Steel Bonding via Inductive Heating

2006 ◽  
Author(s):  
Brian D. Sosnowchik ◽  
Liwei Lin ◽  
Albert P. Pisano
Keyword(s):  
Bonding Temperature ◽  
Surface Preparation ◽  
Fatigue Tests ◽  
Bonding Process ◽  
Inductive Heating ◽  
Sensor Applications ◽  
Mems Sensor ◽  
Sensing Applications ◽  
Minimal Damage ◽  
Point Bend

In this work, we present a rapid, low temperature process for the bonding of silicon to steel through the use of inductive heating for MEMS sensor applications. The bonding process takes as short as three seconds with a maximum bonding temperature as low as 230°C at the steel surface. The bonding strength is strong, and causes minimal damage to steel. The process has also been shown to work using leaded and leadfree bonding solder with minimal surface preparation to the steel. Four characterization experiments – tensile and compressive 4-point bend, axial extension, and fatigue tests – have been performed to validate the bonding process and materials. As such, this work illustrates the promise of applying inductive heating for the rapid silicon bonding to steel components for MEMS sensing applications.

scholarly journals Experimental Evaluation of a Two Degree of Freedom Capacitive MEMS Sensor For Velocity Measurements

2011 ◽  
Vol 25 ◽  
pp. 619-622 ◽  
Author(s):  
Ali Alshehri ◽  
Paolo Gardonio ◽  
Stephen Elliott ◽  
Michele Zilletti ◽  
Michael Kraft
Keyword(s):  
Experimental Evaluation ◽  
Degree Of Freedom ◽  
Velocity Measurements ◽  
Mems Sensor ◽  
Capacitive Mems ◽  
Two Degree Of Freedom

Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 000397-000420
Author(s):  
Ted Tessier
Keyword(s):  
Smart Phone ◽  
Cost Effective ◽  
Wearable Electronics ◽  
Wafer Level ◽  
Technology Infrastructure ◽  
Sensor Applications ◽  
Mems Sensor ◽  
Sensing Applications ◽  
Communication Devices ◽  
Multiple Sensor

WLCSP has been widely deployed in portable computing and communication devices for efficient die level packaging of integrated semiconductor and integrated passive applications. More recently with the proliferation of smart phone capabilities and applications as well as the emergence of Internet of Things and Wearable Electronics, MEMS and sensor devices in minimized package formats have become increasingly pervasive. These include image sensors, light sensors, finger print sensors as well as accelerometer, gyroscope and other MEMS motion sensing devices. It is predicted that the widespread adoption of WLCSP packaging for sensing applications will accelerate the proliferation of the incorporation of multiple sensor technologies within future communication devices. A number of these MEMS/Sensor applications have been able to leverage the existing WLCSP technology infrastructure and has led to opportunities to packaging and cost-effective standardization and miniaturization. On the other hand, some significant new changes to WLCSP process flows have also emerged that have had to be addressed. This paper will provide an overview of MEMS and Sensor applications that are currently or will use 2D, 2.5D or 3D wafer level packaging formats. Process enhancements including the ability to process thinner substrates with the adoption of temporary carrier technologies will also be highlighted.

A User’s Perspective: Packaging Achieves Test Affordability

2000 ◽  
Author(s):  
Wayne P. Liu
Keyword(s):  
Stress Testing ◽  
Impact Test ◽  
Separation Bubble ◽  
Hardware Cost ◽  
Good Data ◽  
Sensor Applications ◽  
Sensor Performance ◽  
Mems Sensor ◽  
Set Up ◽  
The Cost

Abstract Sensor performance and cost are typically the main features reviewed by potential users of MEMS sensor applications. However with more options becoming available, experienced users will begin to consider more than just performance and hardware cost and will seek packaging features which reduce the effort needed to set up, calibrate and successfully operate MEMS sensor systems. A reduction in the cost of effort needed to collect good data will impact test affordability. Data from MEMS shear stress testing on cylinder boundary layer and separation bubble features will be presented to show how packaging can affect both performance and affordability. Manufacturers should ask: What is remembered the most at the conclusion of a MEMS application, the cost of hardware or the cost of effort required to collect good data?

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