An optimal design of cooling system for injection mold

2002 ◽  
Vol 41 (2) ◽  
pp. 261-271 ◽  
Author(s):  
Ji-Zhao Liang
2021 ◽  
Vol 248 ◽  
pp. 114800
Author(s):  
Quangang Xia ◽  
Tong Zhang ◽  
Yuan Gao ◽  
XiChen Ye ◽  
Ciming Guan

2019 ◽  
Vol 27 (03) ◽  
pp. 1950021
Author(s):  
N. A. Zolpakar ◽  
N. Mohd-Ghazali

Although the thermoacoustic refrigeration (TAR) system has been recognized as a potential alternative environmentally cooling system, the low coefficient of performance (COP) has yet to make it marketable. One major factor contributing towards the low COP is the fabrication method applied to the stack component which is the most important component in the TAR. In this paper, comparison of the performance of a (i) 3D printed stack, (ii) a hand fabricated Mylar stack and (iii) an off-the-shelf Celcor substrates stack has been done; these being based on optimized design parameters using Multi-Objective Genetic Algorithm (MOGA). The performance is determined from the temperature attained at the cold end of the stack and the temperature difference across the stack. Experimental results showed that the 3D printed stack has the best performance by achieving a temperature, [Formula: see text]C at the cold end and a temperature difference of [Formula: see text]C across the stack, about 60% of the designed temperature difference even though the fabricated 3D printed stack deviated from the optimal design due to fabrication constraint as compared to that of the Mylar stack which was closer to the optimal design. This 3D printing of the stack promises a big potential in the improvement of the TAR performance because of the consistency achievable with the precise dimensions of the stack.


Energy ◽  
2014 ◽  
Vol 66 ◽  
pp. 839-848 ◽  
Author(s):  
Kyung Min Kim ◽  
Hokyu Moon ◽  
Jun Su Park ◽  
Hyung Hee Cho

2012 ◽  
Vol 13 (9) ◽  
pp. 1641-1645 ◽  
Author(s):  
Zhen-Zhe Li ◽  
Tai-Hong Cheng ◽  
Dong-Ji Xuan ◽  
Ming Ren ◽  
Gui-Ying Shen ◽  
...  

2014 ◽  
Vol 989-994 ◽  
pp. 3127-3131
Author(s):  
Guo Dong Liang ◽  
Jun Hui Liu

The design of injection die on the upper cover of clamshell phone is introduced. The dual-plate die has side gate for opposite glue injection, the parts are ejected by ejector pin, the side reversed buckle contains three blocks, the reversed buckle at flip shaft consists of two inner sliders, and all the eight inner reversed buckles are made up of inclined pushing rods, and the cooling system embraces "U" shaped cooling waterway. Its application in practice has proved the reasonable die structure, smooth remolding, and qualified plastic part design.


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