Magnetoresistance of a p-type Semiconducting Diamond

1957 ◽  
Vol 70 (5) ◽  
pp. 527-530 ◽  
Author(s):  
E W J Mitchell ◽  
P T Wedepohl
2007 ◽  
Vol 4 (S1) ◽  
pp. S942-S945 ◽  
Author(s):  
Akimitsu Hatta ◽  
Hiroshi Nakatsuma ◽  
Keishi Yanai ◽  
Tsuyoshi Nishikawa

2019 ◽  
Vol 116 (16) ◽  
pp. 7703-7711 ◽  
Author(s):  
Xiaobing Liu ◽  
Xin Chen ◽  
David J. Singh ◽  
Richard A. Stern ◽  
Jinsong Wu ◽  
...  

Diamond is a wide-bandgap semiconductor possessing exceptional physical and chemical properties with the potential to miniaturize high-power electronics. Whereas boron-doped diamond (BDD) is a well-known p-type semiconductor, fabrication of practical diamond-based electronic devices awaits development of an effective n-type dopant with satisfactory electrical properties. Here we report the synthesis of n-type diamond, containing boron (B) and oxygen (O) complex defects. We obtain high carrier concentration (∼0.778 × 1021 cm−3) several orders of magnitude greater than previously obtained with sulfur or phosphorous, accompanied by high electrical conductivity. In high-pressure high-temperature (HPHT) boron-doped diamond single crystal we formed a boron-rich layer ∼1–1.5 μm thick in the {111} surface containing up to 1.4 atomic % B. We show that under certain HPHT conditions the boron dopants combine with oxygen defects to form B–O complexes that can be tuned by controlling the experimental parameters for diamond crystallization, thus giving rise to n-type conduction. First-principles calculations indicate that B3O and B4O complexes with low formation energies exhibit shallow donor levels, elucidating the mechanism of the n-type semiconducting behavior.


Measurements of the magneto-resistance at room temperature are described of three oriented semiconducting diamonds. The values obtained for Δ p/p 0 H 2 are: 2.66 x 10 -10 Oe -2 , 2.10 and 1.32 for the longitudinal effects in the [110], [100] and [111], respectively, and range from (2.79 to 6.80) x 10- 10 for the various transverse effects. The components of the magneto-conductive tensor have been determined from these measurements. The results are compared with calculations carried out for a triply degenerate valence band, assuming that the energy surfaces can be approximated to by two warped spheres and one sphere. These computations are an extension of the two band calculations carried out by Mavroides & Lax (1957) for germanium. In the approximation described the band calculations of Herman (1953), Hall (1958) and Phillips (1958) have been used. The theoretical values of ∑ xxxx are within about 30% of the experimental values, but the predictions for ∑ xxyy and ∑ xyxy are lower than the values determined experimentally. The amount of warping, as indicated by the ratio ∑ xxxx / ∑ xxyy , required to account for the experimental values is less than that of the surfaces for which the calculations have been made. Thus the measured value of ∑ xxxx / ∑ xxyy is 0.51 ± 0.03 while the calculations give 0.80 (Herman), 0.91 (Phillips) and 1.26 (Hall).


2001 ◽  
Vol 50 (8) ◽  
pp. 1616
Author(s):  
KONG GHUN-YANG ◽  
WANG WAN-LU ◽  
LIAO KE-JUN ◽  
MA YONG ◽  
WANG SHU-XIA ◽  
...  

Author(s):  
D.P. Malta ◽  
S.A. Willard ◽  
R.A. Rudder ◽  
G.C. Hudson ◽  
J.B. Posthill ◽  
...  

Semiconducting diamond films have the potential for use as a material in which to build active electronic devices capable of operating at high temperatures or in high radiation environments. A major goal of current device-related diamond research is to achieve a high quality epitaxial film on an inexpensive, readily available, non-native substrate. One step in the process of achieving this goal is understanding the nucleation and growth processes of diamond films on diamond substrates. Electron microscopy has already proven invaluable for assessing polycrystalline diamond films grown on nonnative surfaces.The quality of the grown diamond film depends on several factors, one of which is the quality of the diamond substrate. Substrates commercially available today have often been found to have scratched surfaces resulting from the polishing process (Fig. 1a). Electron beam-induced current (EBIC) imaging shows that electrically active sub-surface defects can be present to a large degree (Fig. 1c). Growth of homoepitaxial diamond films by rf plasma-enhanced chemical vapor deposition (PECVD) has been found to planarize the scratched substrate surface (Fig. 1b).


Author(s):  
H. Yen ◽  
E. P. Kvam ◽  
R. Bashir ◽  
S. Venkatesan ◽  
G. W. Neudeck

Polycrystalline silicon, when highly doped, is commonly used in microelectronics applications such as gates and interconnects. The packing density of integrated circuits can be enhanced by fabricating multilevel polycrystalline silicon films separated by insulating SiO2 layers. It has been found that device performance and electrical properties are strongly affected by the interface morphology between polycrystalline silicon and SiO2. As a thermal oxide layer is grown, the poly silicon is consumed, and there is a volume expansion of the oxide relative to the atomic silicon. Roughness at the poly silicon/thermal oxide interface can be severely deleterious due to stresses induced by the volume change during oxidation. Further, grain orientations and grain boundaries may alter oxidation kinetics, which will also affect roughness, and thus stress.Three groups of polycrystalline silicon films were deposited by LPCVD after growing thermal oxide on p-type wafers. The films were doped with phosphorus or arsenic by three different methods.


Author(s):  
Y. Kikuchi ◽  
N. Hashikawa ◽  
F. Uesugi ◽  
E. Wakai ◽  
K. Watanabe ◽  
...  

In order to measure the concentration of arsenic atoms in nanometer regions of arsenic doped silicon, the HOLZ analysis is carried out underthe exact [011] zone axis observation. In previous papers, it is revealed that the position of two bright lines in the outer SOLZ structures on the[011] zone axis is little influenced by the crystal thickness and the background intensity caused by inelastic scattering electrons, but is sensitive to the concentration of As atoms substitutbnal for Siatomic site.As the result, it becomes possible to determine the concentration of electrically activated As atoms in silicon within an observed area by means of the simple fitting between experimental result and dynamical simulatioan. In the present work, in order to investigate the distribution of electrically activated As in silicon, the outer HOLZ analysis is applied using a nanometer sized probe of TEM equipped with a FEG.Czodiralsld-gown<100>orientated p-type Si wafers with a resistivity of 10 Ώ cm are used for the experiments.TheAs+ implantation is performed at a dose of 5.0X1015cm-2at 25keV.


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