Characterization of FBK 3D pixel sensor modules based on RD53A readout chip for the ATLAS ITk

2021 ◽  
Vol 16 (12) ◽  
pp. C12028
Author(s):  
Md.A.A. Samy ◽  
A. Lapertosa ◽  
L. Vannoli ◽  
C. Gemme ◽  
G.-F. Dalla Betta
Keyword(s):  
Hadron Collider ◽  
Wafer Level ◽  
Atlas Experiment ◽  
Small Pitch ◽  
Innermost Layer ◽  
Before And After ◽  
Noise Measurements ◽  
Threshold Tuning ◽  
New Generation

Abstract CERN is planning to upgrade its Large Hadron Collider to the High Luminosity phase (HL-LHC), pushing detector technologies to cope with unprecedently demanding performance in terms of particle rate and radiation hardness. The ATLAS experiment decided to equip the innermost layer (L0) of its Inner Tracker (ITk) with small-pitch 3D pixels of two different geometries, i.e., 25 µm × 100 µm for the central barrel and 50 µm × 50 µm for the lateral rings. A new generation of 3D pixels featuring these small-pitch dimensions and reduced active thickness (∼150 µm) has been developed to this purpose within a collaboration of INFN and FBK since 2014. Recently, the R&D activities have been focused on the characterization of modules based on sensors compatible with the RD53A readout chip, which were tested in laboratory and at beam lines. In this paper, we report on the characterization of modules irradiated with protons up to a fluence of 1 × 1016 neq/cm2, including threshold tuning and noise measurements, and results from beam tests performed at DESY. Moreover, we will discuss about the electrical characteristics at wafer level and at module level before and after irradiation.

scholarly journals Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

2021 ◽  
Vol 9 ◽  
Author(s):  
Stefano Terzo ◽  
Maurizio Boscardin ◽  
Juan Carlotto ◽  
Gian-Franco Dalla Betta ◽  
Giovanni Darbo ◽  
...  
Keyword(s):  
Hadron Collider ◽  
Radiation Hardness ◽  
Silicon On Insulator ◽  
Sensor Technology ◽  
Pixel Detector ◽  
Single Side ◽  
Pixel Sensors ◽  
Before And After ◽  
The One ◽  
New Generation

The ATLAS experiment will undergo a full replacement of its inner detector to face the challenges posed by the High Luminosity upgrade of the Large Hadron Collider (HL-LHC). The new Inner Tracker (ITk) will have to deal with extreme particle fluences. Due to its superior radiation hardness the 3D silicon sensor technology has been chosen to instrument the innermost pixel layer of ITk, which is the most exposed to radiation damage. Three foundries (CNM, FBK, and SINTEF), have developed and fabricated novel 3D pixel sensors to meet the specifications of the new ITk pixel detector. These are produced in a single-side technology on either Silicon On Insulator (SOI) or Silicon on Silicon (Si-on-Si) bonded wafers by etching both n- and p-type columns from the same side. With respect to previous generations of 3D sensors they feature thinner active substrates and smaller pixel cells of 50 × 50 and 25 × 100 µm2. This paper reviews the main design and technological issues of these novel 3D sensors, and presents their characterization before and after exposure to large radiation doses close to the one expected for the innermost layer of ITk. The performance of pixel modules, where the sensors are interconnected to the recently developed RD53A chip prototype for HL-LHC, has been investigated in the laboratory and at beam tests. The results of these measurements demonstrate the excellent radiation hardness of this new generation of 3D pixel sensors that enabled the project to proceed with the pre-production for the ITk tracker.

scholarly journals Characterization of Irradiated Boron, Carbon-Enriched and Gallium Si-on-Si Wafer Low Gain Avalanche Detectors

Instruments ◽  
2021 ◽  
Vol 6 (1) ◽  
pp. 2
Author(s):  
Lucía Castillo García ◽  
Evangelos Leonidas Gkougkousis ◽  
Chiara Grieco ◽  
Sebastian Grinstein
Keyword(s):  
Performance Studies ◽  
Hadron Collider ◽  
Electrical Characterization ◽  
Full Characterization ◽  
Silicon Sensors ◽  
Pile Up ◽  
Before And After ◽  
And Performance ◽  
Si Wafer

Low Gain Avalanche Detectors (LGADs) are n-on-p silicon sensors with an extra doped p-layer below the n-p junction which provides signal amplification. The moderate gain of these sensors, together with the relatively thin active region, provides excellent timing performance for Minimum Ionizing Particles (MIPs). To mitigate the effect of pile-up during the High-Luminosity Large Hadron Collider (HL-LHC) era, both ATLAS and CMS experiments will install new detectors, the High-Granularity Timing Detector (HGTD) and the End-Cap Timing Layer (ETL), that rely on the LGAD technology. A full characterization of LGAD sensors fabricated by Centro Nacional de Microelectrónica (CNM), before and after neutron irradiation up to 1015 neq/cm2, is presented. Sensors produced in 100 mm Si-on-Si wafers and doped with boron and gallium, and also enriched with carbon, are studied. The results include their electrical characterization (I-V, C-V), bias voltage stability and performance studies with the Transient Current Technique (TCT) and a Sr-90 radioactive source setup.

scholarly journals Fabrication and Characterization of Bioglass

2018 ◽  
Vol 7 (2) ◽  
pp. 99-102
Author(s):  
Dalveer Singh ◽  
Sandeep Singh ◽  
Gurpreet Singh
Keyword(s):  
Glass Ceramics ◽  
Borosilicate Glasses ◽  
Living Tissue ◽  
Bioactive Glasses ◽  
Bioactive Properties ◽  
Amorphous Nature ◽  
Before And After ◽  
Fabrication And Characterization ◽  
New Generation

Glasses are common in use now days. These are used in different applications like domestic, automobile, telecommunication etc. The glasses are very useful materials because of their impressive properties. Few years back a new generation of glasses were developed i.e. bioactive glasses and bioactive glass ceramics. The glasses are used for bone grafting now-a-days because of their impressive bioactive properties. These glasses have tendency to form bonds with the living tissue organs. The future of these glasses will be bright in dental, orthopedics and prosthetic applications. In the present work borosilicate glasses of different compositions have been studied. The different elements were added with appropriate mol% to compose a new bioglass composition. The samples were prepared by melt quench route. The samples were immersed for 21 days in SBF. The samples were characterized before and after immersion in SBF by different techniques. The XRD technique was done to confirm the amorphous nature of glass before immersion and after immersion. The SEM and EDX were done to check the changes on the surface after immersion. The sample S1 has better biocompatibility results than S2 andS3. The formation of apatite on the glass samples were confirmed by all techniques mentioned above.

WHAT YOUR NEXT EXPERIMENT'S DATA WILL LOOK LIKE: EVENT STORES IN THE LARGE HADRON COLLIDER ERA

2005 ◽  
Vol 20 (16) ◽  
pp. 3871-3873 ◽  
Author(s):  
DAVID MALON
Keyword(s):  
Large Hadron Collider ◽  
Hadron Collider ◽  
Simulated Data ◽  
Computing Power ◽  
Atlas Experiment ◽  
Computing Model ◽  
Data Volume ◽  
Order Of Magnitude ◽  
Key Issues ◽  
New Generation

Each new generation of collider experiments confronts the challenge of delivering an event store having at least the performance and functionality of current-generation stores, in the presence of an order of magnitude more data and new computing paradigms (object orientation just a few years ago; grid and service-based computing today). The ATLAS experiment at the Large Hadron Collider, for example, will produce 1.6-megabyte events at 200 Hz–an annual raw data volume of 3.2 petabytes. With derived and simulated data, the total volume may approach 10 petabytes per year. Scale, however, is not the only challenge. In the Large Hadron Collider (LHC) experiments, the preponderance of computing power will come from outside the host laboratory. More significantly, no single site will host a complete copy of the event store–data will be distributed, not simply replicated for convenience, and many physics analyses will routinely require distributed (grid) computing. This paper uses the emerging ATLAS computing model to provide a glimpse of how next-generation event stores are taking shape, touching on key issues in navigation, distribution, scale, coherence, data models and representation, metadata infrastructure, and the role(s) of databases in event store management.

An Electron Microscope Study of Interdiffusion and Compound Formation in Ta-Au Thin Films

1973 ◽  
Vol 31 ◽  
pp. 32-33 ◽  
Author(s):  
T. C. Tisone ◽  
S. Lau
Keyword(s):  
Electron Microscope ◽  
Electron Microscope Study ◽  
Thermally Grown Oxide ◽  
Ion Milling ◽  
Compound Formation ◽  
Technology Application ◽  
Transmission Electron ◽  
Before And After ◽  
Au Thin Films

In a study of the properties of a Ta-Au metallization system for thin film technology application, the interdiffusion between Ta(bcc)-Au, βTa-Au and Ta2M-Au films was studied. Considered here is a discussion of the use of the transmission electron microscope(TEM) in the identification of phases formed and characterization of the film microstructures before and after annealing.The films were deposited by sputtering onto silicon wafers with 5000 Å of thermally grown oxide. The film thicknesses were 2000 Å of Ta and 2000 Å of Au. Samples for TEM observation were prepared by ultrasonically cutting 3mm disks from the wafers. The disks were first chemically etched from the silicon side using a HNO3 :HF(19:5) solution followed by ion milling to perforation of the Au side.

Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

1996 ◽  
Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn
Keyword(s):  
Process Development ◽  
Process Integration ◽  
Wafer Level ◽  
Electrical Failure ◽  
Analysis Techniques ◽  
Integration Approach ◽  
Intermetal Dielectric ◽  
Metallization Process ◽  
Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

scholarly journals Adsorption Studies on Magnetic Nanoparticles Functionalized with Silver to Remove Nitrates from Waters

Water ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 1757
Author(s):  
Yesica Vicente-Martínez ◽  
Manuel Caravaca ◽  
Antonio Soto-Meca ◽  
Miguel Ángel Martín-Pereira ◽  
María del Carmen García-Onsurbe
Keyword(s):  
Magnetic Nanoparticles ◽  
Nitrate Content ◽  
Adsorption Efficiency ◽  
Experimental Conditions ◽  
Dependent Behavior ◽  
Before And After ◽  
Naoh Solution ◽  
High Concentrations ◽  
Interference Studies

This paper presents a novel procedure for the treatment of contaminated water with high concentrations of nitrates, which are considered as one of the main causes of the eutrophication phenomena. For this purpose, magnetic nanoparticles functionalized with silver (Fe3O4@AgNPs) were synthesized and used as an adsorbent of nitrates. Experimental conditions, including the pH, adsorbent and adsorbate dose, temperature and contact time, were analyzed to obtain the highest adsorption efficiency for different concentration of nitrates in water. A maximum removal efficiency of 100% was reached for 2, 5, 10 and 50 mg/L of nitrate at pH = 5, room temperature, and 50, 100, 250 and 500 µL of Fe3O4@AgNPs, respectively. The characterization of the adsorbent, before and after adsorption, was performed by energy dispersive X-ray spectroscopy, scanning electron microscopy, Brunauer-Emmett-Teller analysis and Fourier-transform infrared spectroscopy. Nitrates can be desorbed, and the adsorbent can be reused using 500 µL of NaOH solution 0.01 M, remaining unchanged for the first three cycles, and exhibiting 90% adsorption efficiency after three regenerations. A deep study on equilibrium isotherms reveals a pH-dependent behavior, characterized by Langmuir and Freundlich models at pH = 5 and pH = 1, respectively. Thermodynamic studies were consistent with physicochemical adsorption for all experiments but showed a change from endothermic to exothermic behavior as the temperature increases. Interference studies of other ions commonly present in water were carried out, enabling this procedure as very selective for nitrate ions. In addition, the method was applied to real samples of seawater, showing its ability to eliminate the total nitrate content in eutrophized waters.

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