scholarly journals Study on the removal of iron impurities in methanesulfonic acid tin plating bath

Author(s):  
LIU Hou-li ◽  
CHEN Jian-Jun ◽  
PAN Hong-Liang
1996 ◽  
Vol 94 (12) ◽  
pp. 18-20 ◽  
Author(s):  
K.S. Rajam ◽  
Indira Rajagopal ◽  
S.R. Rajogopalan ◽  
R.V. Krishnan

2015 ◽  
Vol 730 ◽  
pp. 178-182
Author(s):  
Yong Tan

Methyl sulfonate tin plating bath is a kind of high production efficiency,good environmental performance and excellent performance of the new type of tin plating bath.Research by electrochemical technology analysis an influence on electrochemical performance of the tin plating bath by adding methyl sulfonate in bath.The results show that it significantly improve the polarization properties of the bath after adding additives and the deposition potential of tin ion. The result is that polarization properties of bath perform the best when additive A is added to25mL/L,That the throwing power of the bath is 98 % and the cover ing power is 100 %.


2015 ◽  
Vol 658 ◽  
pp. 125-128 ◽  
Author(s):  
Naray Pewnim ◽  
Sudipta Roy

Methanesulfonic acid (MSA) is an environmentally benign supporting electrolyte that is an attractive alternative to traditional copper and tin plating baths based on cyanide or fluoborate. This is mainly due to its low toxicity, volatility, and good biodegradability as well as other desirable characteristics for electrodeposition such as high metal salt solubility and conductivity. The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid was explored through the use of an electrochemical quartz crystal nanobalance to monitor surfactant adsorption and desorption from the electrode surface. It was found that the surfactant adsorbs on the surface and inhibits copper deposition by blocking the reduction and oxidation reaction for copper.


1963 ◽  
Vol 14 (12) ◽  
pp. 481-487
Author(s):  
Nobuyasu DOHI ◽  
Mikio KAMON
Keyword(s):  

Author(s):  
C. W. Price ◽  
E. F. Lindsey

Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.


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