scholarly journals CFD Simulation and Analytical Validation of Rectangular and Square microchannel heat sink with liquid water as cooling medium

2020 ◽  
Vol 998 ◽  
pp. 012030
Author(s):  
Saurabh Narayan Pawar ◽  
Nilesh Balkishanji Totla
Keyword(s):  
Liquid Water ◽  
Heat Sink ◽  
Cfd Simulation ◽  
Microchannel Heat Sink ◽  
Analytical Validation ◽  
Cooling Medium ◽  
Square Microchannel

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

scholarly journals Study on flow and heat transfer of liquid metal in a new top-slotted microchannel heat sink

2021 ◽  
Vol 621 ◽  
pp. 012054
Author(s):  
Zhiwei Chen ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Flow And Heat Transfer
Sign in / Sign up

Export Citation Format

Share Document