Introduce a novel configurationof microchannel andhigh-conductivity insertsfor cooling of disc-shaped electronic components

2019 ◽  
Vol 30 (6) ◽  
pp. 2845-2859 ◽  
Author(s):  
Reza Dadsetani ◽  
Ghanbar Ali Sheikhzadeh ◽  
Mohammad Reza Hajmohammadi ◽  
Mohammad Reza Safaei
Keyword(s):  
Thermal Conductivity ◽  
Hybrid Method ◽  
High Thermal Conductivity ◽  
Maximum Temperature ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Electronic Components ◽  
Content Type ◽  
Micro Pump ◽  
Hybrid Configuration

Purpose Electronic components’ efficiency is the cornerstone of technology progress. The cooling process used for electronic components plays a main role in their performance. Embedded high-conductivity material and provided microchannel heat sink are two common cooling methods. The former is expensive to implement while the latter needs micro-pump, which consumes energy to circulate the flow. The aim of this study is providing a new configuration and method for improving the performance of electronic components. Design/methodology/approach To manage these challenges and improve the cooling efficiency, a novel method named Hybrid is presented here. Each method's performance has been investigated, and the results are widely compared with others. Considering the micro-pump power, the supply of the microchannel flow and the thermal conductivity ratio (thermal conductivity ratio is defined as the ratio of thermal conductivity of high thermal conductivity material to the thermal conductivity of base solid), the maximum disk temperature of each method was evaluated and compared to others. Findings The results indicated that the Hybrid method can reduce the maximum disk temperature up to 90 per cent compared to the embedded high thermal conductivity at the same thermal conductivity ratio. Moreover, the Hybrid method further reduces the maximum disk temperature up to 75 per cent compared to the microchannel, at equivalent power consumption. Originality/value The information in this research is presented in such a way that designers can choose the desired composition, the limited amount of consumed energy and the high temperature of the component. According to the study of radial-hybrid configuration, the different ratio of microchannel and materials with a high thermal conductivity coefficient in the constant cooling volume was investigated. The goal of the investigation was to decrease the maximum temperature of a plate on constant energy consumption. This aim has been obtained in the radial-hybrid configuration.

Upward and downward conjugate mixed convection heat transfer in a partially porous cavity

2016 ◽  
Vol 26 (1) ◽  
pp. 159-188 ◽  
Author(s):  
Abderrahim Bourouis ◽  
Abdeslam Omara ◽  
Said Abboudi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Mixed Convection ◽  
Transfer Rate ◽  
Vertical Wall ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Content Type ◽  
Moving Wall ◽  
The Right

Purpose – The purpose of this paper is to provide a numerical study of conjugate heat transfer by mixed convection and conduction in a lid-driven enclosure with thick vertical porous layer. The effect of the relevant parameters: Richardson number (Ri=0.1, 1, 10) and thermal conductivity ratio (Rk=0.1, 1, 10, 100) are investigated. Design/methodology/approach – The studied system is a two dimensional lid-driven enclosure with thick vertical porous layer. The left vertical wall of the enclosure is allowed to move in its own plane at a constant velocity. The enclosure is heated from the right vertical wall isothermally. The left and the right vertical walls are isothermal but temperature of the outside of the right vertical wall is higher than that of the left vertical wall. Horizontal walls are insulated. The governing equations are solved by finite volume method and the SIMPLE algorithm. Findings – From the finding results, it is observed that: for the two studied cases, heat transfer rate along the hot wall is a decreasing function of thermal conductivity ratio irrespective of Richardson numbers contrary to the heat transfer rate along the fluid-porous layer interface which is an increasing function of thermal conductivity ratio. At forced convection dominant regime, the difference between heat transfer rate for upward and downward moving wall is insensitive to the thermal conductivity ratio. For downward moving wall, average Nusselt number is higher than that of upward moving wall. Practical implications – Some applications: building applications, furnace design, nuclear reactors, air solar collectors. Originality/value – From the bibliographic work and the authors’ knowledge, the conjugate mixed convection in lid-driven partially porous enclosures has not yet been investigated which motivates the present work that represent a continuation of the preceding investigations.

Conjugate heat transfer in porous triangular enclosures with thick bottom wall

2009 ◽  
Vol 19 (5) ◽  
pp. 650-664 ◽  
Author(s):  
Yasin Varol ◽  
Hakan F. Oztop ◽  
Ioan Pop
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Natural Convection ◽  
Conjugate Heat Transfer ◽  
Bottom Wall ◽  
Thick Wall ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Governing Equations ◽  
Content Type

PurposeThe purpose of this paper is to study the conjugate heat transfer via natural convection and conduction in a triangular enclosure filled with a porous medium.Design/methodology/approachDarcy flow model was used to write governing equations with Boussinesq approximation. The transformed governing equations are solved numerically using a finite difference technique. It is assumed that the enclosure consists of a conducting bottom wall of finite thickness, an adiabatic (insulated) vertical wall and a cooled inclined wall.FindingsFlow patterns, temperature and heat transfer were presented at different dimensionless thickness of the bottom wall, h, from 0.05 to 0.3, different thermal conductivity ratio between solid material and fluid, k, from 0.44 to 283 and Rayleigh numbers, Ra, from 100 to 1000. It is found that both thermal conductivity ratio and thickness of the bottom wall can be used as control parameters for heat transport and flow field.Originality/valueIt is believed that this is the first paper on conduction‐natural convection in porous media filled triangular enclosures with thick wall. In the last years, most of the researchers focused on regular geometries such as rectangular or square cavity bounded by thick wall.

scholarly journals Constructal Design of an Arrow-Shaped High Thermal Conductivity Channel in a Square Heat Generation Body

Entropy ◽  
2020 ◽  
Vol 22 (4) ◽  
pp. 475 ◽  
Author(s):  
Fengyin Zhang ◽  
Huijun Feng ◽  
Lingen Chen ◽  
Jiang You ◽  
Zhihui Xie
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Heat Generation ◽  
Degrees Of Freedom ◽  
High Thermal Conductivity ◽  
Maximum Temperature ◽  
Thermal Conductivity Ratio ◽  
Maximum Temperature Difference ◽  
Conduction Model ◽  
Three Degrees Of Freedom

A heat conduction model with an arrow-shaped high thermal conductivity channel (ASHTCC) in a square heat generation body (SHGB) is established in this paper. By taking the minimum maximum temperature difference (MMTD) as the optimization goal, constructal designs of the ASHTCC are conducted based on single, two, and three degrees of freedom optimizations under the condition of fixed ASHTCC material. The outcomes illustrate that the heat conduction performance (HCP) of the SHGB is better when the structure of the ASHTCC tends to be flat. Increasing the thermal conductivity ratio and area fraction of the ASHTCC material can improve the HCP of the SHGB. In the discussed numerical examples, the MMTD obtained by three degrees of freedom optimization are reduced by 8.42% and 4.40%, respectively, compared with those obtained by single and two degrees of freedom optimizations. Therefore, three degrees of freedom optimization can further improve the HCP of the SHGB. Compared the HCPs of the SHGBs with ASHTCC and the T-shaped one, the MMTD of the former is reduced by 13.0%. Thus, the structure of the ASHTCC is proven to be superior to that of the T-shaped one. The optimization results gained in this paper have reference values for the optimal structure designs for the heat dissipations of various electronic devices.

MHD natural convection flow in cavities filled with square solid blocks

2014 ◽  
Vol 24 (8) ◽  
pp. 1813-1830 ◽  
Author(s):  
Majid Ashouri ◽  
Mohammad Behshad Shafii ◽  
Hossein Rajabi Kokande
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Nusselt Number ◽  
Natural Convection ◽  
Numerical Code ◽  
Thermal Conductivity Ratio ◽  
Convection Flow ◽  
Conductivity Ratio ◽  
Natural Convection Flow ◽  
Content Type

Purpose – The purpose of this paper is to study the influence of magnetic field on natural convection inside the enclosures partially filled with conducting square solid obstacles. Also, the effect of thermal conductivity ratio between the solid and fluid materials is investigated for different number of solid blocks. Design/methodology/approach – The dimensionless governing equations are transformed into sets of algebraic equations using finite volume method and momentum equations are solved by the SIMPLE algorithm with the hybrid scheme. The validation of the numerical code was conducted by comparing the results of average Nusselt number with previously published works. Findings – The results indicate that both the magnetic field and solid blocks can significantly affect the flow and temperature fields. It is shown that for a given Rayleigh number, variation of Nusselt number might be increasing or decreasing with change in solid-to-fluid thermal conductivity ratio depending on magnetic field strength and number of solid blocks. Originality/value – No work has been reported previously on the effect of magnetic field on natural convection flow in a cavity partially filled with square solid blocks. The numerical analysis of conductivity ratio between the solid and fluid materials under the effect of magnetic field have been carried out for the first time.

Thermosolutal natural convection in a partly porous cavity with sinusoidal wall heating and cooling

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Abdeslam Omara ◽  
Mouna Touiker ◽  
Abderrahim Bourouis
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Clear Fluid ◽  
Content Type ◽  
Heating And Cooling ◽  
Fortran Code ◽  
Double Diffusive ◽  
Sinusoidal Wall

Purpose This paper aims to consider numerical analysis of laminar double-diffusive natural convection inside a non-homogeneous closed medium composed of a saturated porous matrix and a clear binary fluid under spatial sinusoidal heating/cooling on one side wall and uniform salting. Design/methodology/approach The domain of interest is a partially square porous enclosure with sinusoidal wall heating and cooling. The fluid flow, heat and mass transfer dimensionless governing equations associated with the corresponding boundary conditions are discretized using the finite volume method. The resulting algebraic equations are solved by an in-house FORTRAN code and the SIMPLE algorithm to handle the non-linear character of conservation equations. The validity of the in-house FORTRAN code is checked by comparing the current results with previously published experimental and numerical works. The effect of the porous layer thickness, the spatial frequency of heating and cooling, the Darcy number, the Rayleigh number and the porous to fluid thermal conductivity ratio is analyzed. Findings The results demonstrate that for high values of the spatial frequency of heating and cooling (f = 7), temperature contours show periodic variations with positive and negative values providing higher temperature gradient near the thermally active wall. In this case, the temperature variation is mainly in the porous layer, while the temperature of the clear fluid region is practically the same as that imposed on the left vertical wall. This aspect can have a beneficial impact on thermal insulation. Besides, the porous to fluid thermal conductivity ratio, Rk, has practically no effect on Shhot wall, contrary to Nuinterface where a strong increase is observed as Rk is increased from 0.1 to 100, and much heat transfer from the hot wall to the clear fluid via the porous media is obtained. Practical implications The findings are useful for devices working on double-diffusive natural convection inside non-homogenous cavities. Originality/value The authors believe that the presented results are original and have not been published elsewhere.

Entropy generation analysis during MHD natural convection flow of hybrid nanofluid in a square cavity containing a corrugated conducting block

2019 ◽  
Vol 30 (3) ◽  
pp. 1115-1136 ◽  
Author(s):  
Tahar Tayebi ◽  
Ali J. Chamkha
Keyword(s):  
Magnetic Field ◽  
Heat Transfer ◽  
Thermal Conductivity ◽  
Entropy Generation ◽  
Thermal Conductivity Ratio ◽  
Hybrid Nanofluid ◽  
Conductivity Ratio ◽  
Square Cavity ◽  
Content Type ◽  
Solid Block

Purpose The purpose of this paper is to study the influence of magnetic field on entropy generation and natural convection inside an enclosure filled with a hybrid nanofluid and having a conducting wavy solid block. Also, the effect of fluid–solid thermal conductivity ratio is investigated. Design/methodology/approach The governing equations that are formulated in the dimensionless form are discretized via finite volume method. The velocity–pressure coupling is assured by the SIMPLE algorithm. Heat transfer balance is used to verify the convergence. The validation of the numerical results was performed by comparing qualitatively and quantitatively the results with previously published investigations. Findings The results indicate that the magnetic field and the conductivity ratio of the wavy solid block can significantly affect the dynamic and thermal field and, consequently, the heat transfer rate and entropy generation because of heat transfer, fluid friction and magnetic force. Originality/value To the best of the authors’ knowledge, the present numerical study is the first attempt to use hybrid nanofluid for studying the entropy generation because of magnetohydrodynamic natural convective flow in a square cavity with the presence of a wavy circular conductive cylinder. Irreversibilities due to magnetic effect are taken into account. The effect of fluid–solid thermal conductivity ratio is considered.

Effects of anisotropy and solid/liquid thermal conductivity ratio during inverted Bridgman growth

2002 ◽  
Author(s):  
Julaporn Kaenton ◽  
Victoria Timchenko ◽  
Mohammed El Ganaoui ◽  
Graham de Vahl Davis ◽  
Eddie Leonardi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Bridgman Growth ◽  
Liquid Thermal Conductivity ◽  
Solid Liquid

Design and Optimization of a Composite Heat Spreader to Improve the Thermal Management of a 3D Integrated Circuit

2021 ◽  
Author(s):  
Andisheh Tavakoli ◽  
Kambiz Vafai
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Variable Temperature ◽  
Heat Removal ◽  
High Conductivity ◽  
High Thermal Conductivity ◽  
Maximum Temperature ◽  
Optimal Distribution ◽  
Heat Spreader ◽  
The Impact

Abstract The present study analyzes the optimal distribution of a limited amount of high thermal conductivity material to enhance the heat removal of circular 3D integrated circuits, IC. The structure of the heat spreader is designed as a composite of high thermal conductivity (Boron Arsenide) and moderate thermal conductivity (copper) materials. The volume ratio of high-conductivity inserts to the total volume of the spreader is set at a fixed pertinent ratio. Two different boundary conditions of constant and variable temperature are considered for the heat sink. To examine the impact of adding high-conductivity inserts on the cooling performance of the heat spreader, various patterns of the single and double ring inserts are studied. A parametric study is performed to find the optimal location of the rings. Moreover, the optimal distribution of the high-conductivity material between the inner and outer rings is found. The results show that for the optimal conditions, the maximum temperature of the 3D IC is reduced up to 10%; while the size of the heat sink, and heat spreader can be diminished by as much as 200%.

Effects of a centered conducting body on natural convection of non-Newtonian fluid in a square enclosure with time-periodic temperature distribution

2020 ◽  
Author(s):  
Peixin Ye ◽  
Dinggen Li ◽  
Zihao Yu ◽  
Haifeng Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Capacity ◽  
Transient Heat Transfer ◽  
Thermal Conductivity Ratio ◽  
Conductivity Ratio ◽  
Transfer Ratio ◽  
Periodic Temperature ◽  
Power Law Index ◽  
Time Periodic

In this paper, a modified lattice Boltzmann model that incorporates the effect of heat capacity is adopted to study the effects of a centered conducting body on natural convection of non-Newtonian fluid in a square cavity with time-periodic temperature distribution. The effects of power-law index, Rayleigh number, heat capacity ratio, thermal conductivity ratio, body size, temperature pulsating period and the temperature pulsating amplitude on fluid flow and heat transfer are analyzed in detail. The results showed that the increase of Rayleigh number and thermal conductivity ratio as well as the decrease of power-law index can strengthen both transient and global heat transfer, while the increase of heat capacitance of fluid to the solid wall can only enhance the transient heat transfer, and has little effect on the overall heat transfer. Further, the increase of body size will reduce both the transient heat transfer ratio and the overall heat transfer ratio. In addition, the decrease of temperature pulsating period can enhance the transient heat transfer, but it will slightly weaken the overall heat transfer. Finally, the results show that both the transient and the overall heat transfer ratio are increased with the increase of temperature pulsating amplitude.

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

2017 ◽  
Vol 27 (11) ◽  
pp. 2433-2450 ◽  
Author(s):  
Eric Monier-Vinard ◽  
Brice Rogie ◽  
Valentin Bissuel ◽  
Najib Laraqi ◽  
Olivier Daniel ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Model ◽  
Effective Thermal Conductivity ◽  
Three Dimensional ◽  
Computation Time ◽  
Printed Wiring Board ◽  
Electronic Components ◽  
Content Type ◽  
Three Dimensional Representation ◽  
Wiring Board

Purpose Latest Computational Fluid Dynamics (CFDs) tools allow modeling more finely the conjugate thermo-fluidic behavior of a single electronic component mounted on a Printed Wiring Board (PWB). A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. The purpose of this study is to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results to assess their relevance. Design/methodology/approach The present study focuses on the case of a Ball Grid Array (BGA) package of 208 solder balls that connect the component electronic chip to the Printed Wiring Board. Its complete geometrical definition has to be coupled with a realistic board layers layout and a fine description of their numerous copper traces to appropriately predict the way the heat is spread throughout that multi-layer composite structure. The numerical model computations were conducted on four CFD software then compare to experiment results. The component thermal metrics for single-chip packages are based on the standard promoted by the Joint Electron Device Engineering Council (JEDEC), named JESD-51. The agreement of the numerical predictions and measurements has been done for free and forced convection. Findings The present work shows that the numerical model error is lower than 2 per cent for various convective boundary conditions. Moreover, the establishment of realistic numerical models of electronic components permits to properly apprehend multi-physics design issues, such as joule heating effect in copper traces. Moreover, the practical modeling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were tested and appeared to be tricky. A new approach based on an effective thermal conductivity matrix is investigated to reduce computation time. The obtained numerical results highlight a good agreement with experimental data. Research limitations/implications The study highlights that the board three-dimensional modeling is mandatory to properly match the set of experiment results. The conventional approach based on a single homogenous layer using effective thermal conductivity calculation has to be banned. Practical implications The thermal design of complex electronic components is henceforth under increasing control. For instance, the impact of gold wire-bonds can now be investigated. The three-dimensional geometry of sophisticated packages, such as in BGA family, can be imported with all its internal details as well as those of its associated test board to build a realistic numerical model. The establishment of behavioral models such as DELPHI Compact Thermal Models can be performed on a consistent three-dimensional representation with the aim to minimize computation time. Originality/value The study highlights that multi-layer copper trace plane discretization could be used to strongly reduce computation time while conserving a high accuracy level.

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