Characterization of picosecond pulse propagation in a microstrip line divider

1992 ◽  
Vol 2 (5) ◽  
pp. 191-193 ◽  
Author(s):  
Y. Qian ◽  
L. Zhu ◽  
E. Yamashita
Keyword(s):  
Microstrip Line ◽  
Pulse Propagation ◽  
Picosecond Pulse

Characterization of Polypropylene Staple Yarns by Acoustic Dynamic Modulus

2013 ◽  
Vol 586 ◽  
pp. 3-7
Author(s):  
Dana Kremenakova ◽  
Jiří Militký ◽  
Juan Huang
Keyword(s):  
Dynamic Modulus ◽  
Pulse Propagation ◽  
Tensile Modulus ◽  
Polypropylene Fibers ◽  
Orientation Factor ◽  
Cross Sectional ◽  
Indirect Measure ◽  
Yarn Twist ◽  
Propagation Technique

The acoustic or sonic pulse-propagation technique for the measurement of dynamic elastic modulus has the advantage of not being dependent on the sample cross-sectional characteristics. This technique also gives a direct measure of modulus rather than the indirect measure in the form of load versus extension. The sonic tests are relatively simple to apply and are nondestructive. The values of sonic modulus of fibrous structures are dependent on the orientation of components and packing density as well. The main aim of this work is to quantify effect of yarn twist on the sonic modulus of staple yarns from polypropylene fibers. The results are compared with selected models of yarn twist influence on the mechanical properties of staple yarns. The correlation between yarn orientation factor defined by Pan and sonic modulus are shown. The sonic modulus is compared with tensile modulus of yarns.

Liquid Crystal Polymer (LCP) for Characterization of Millimer-Wave Transmission Lines and Bandpass Filters

2009 ◽  
Author(s):  
H. J. Lu ◽  
Y. X. Guo ◽  
K. Faeyz ◽  
C. K. Cheng ◽  
J. Wei
Keyword(s):  
Liquid Crystal ◽  
Millimeter Wave ◽  
Transmission Lines ◽  
Microstrip Line ◽  
Characteristic Impedance ◽  
Wave Transmission ◽  
60 Ghz ◽  
Crystal Polymer ◽  
Measurement Results

In this paper, a multi-layer LCP substrate fabrication process was described and millimeter wave transmission lines and filters were designed and fabricated on the LCP substrate. Various transitions from a CPW to a microstrip line with their characteristic impedance being 50 ohms were investigated. The characteristics of the wirebonding assembly for connecting two transmission lines was also examined. The measurement results show that an insertion loss of 1.3 dB at 60 GHz can be achieved for the two-wire bonding trasmisssion line including two transitions from a CPW to a microstrip line.

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