Reliability assessment of isotropically conductive adhesive joints in surface mount applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.386266 ◽

1995 ◽

Vol 18 (2) ◽

pp. 305-312 ◽

Author(s):

R.S. Rorgren ◽

Johan Liu

Keyword(s):

Reliability Assessment ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Surface Mount ◽

Isotropically Conductive Adhesive

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Reliability assessment of isotropically conductive adhesive joints surface mount applications

Microelectronics Reliability ◽

10.1016/0026-2714(96)84466-0 ◽

1996 ◽

Vol 36 (4) ◽

pp. 553

Keyword(s):

Reliability Assessment ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Surface Mount ◽

Isotropically Conductive Adhesive

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Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) ◽

10.1109/adhes.1998.742006 ◽

2002 ◽

Author(s):

J.H. Constable ◽

T. Kache ◽

H. Teichmann ◽

S. Muhle ◽

M.A. Gaynes

Keyword(s):

Fatigue Life ◽

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Resistance Monitoring ◽

Pull Strength ◽

Isotropically Conductive Adhesive

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Thermal fatigue cracking of surface mount conductive adhesive joints

Soldering & Surface Mount Technology ◽

10.1108/09540910410517059 ◽

2004 ◽

Vol 16 (1) ◽

pp. 48-52 ◽

Author(s):

Zhimin Mo ◽

Zonghe Lai ◽

Shiming Li ◽

Johan Liu

Keyword(s):

Thermal Fatigue ◽

Fatigue Cracking ◽

Adhesive Joints ◽

Conductive Adhesive ◽

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DURABILITY OF ANISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS IN SURFACE MOUNT APPLICATIONS AND IN FLEXIBLE TO RIGID BOARD INTERCONNECTION

Journal of Electronics Manufacturing ◽

10.1142/s0960313195000268 ◽

1995 ◽

Vol 05 (04) ◽

pp. 253-261 ◽

Author(s):

G. F. C. M. LIJTEN ◽

H. M. VAN NOORT ◽

P. J. M. BERIS

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

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Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.705467 ◽

1998 ◽

Vol 21 (2) ◽

pp. 215-225 ◽

Author(s):

J.C. Jagt

Keyword(s):

State Of The Art ◽

Adhesive Joints ◽

The State ◽

Conductive Adhesive ◽

Electrically Conductive ◽

Surface Mount ◽

Electrically Conductive Adhesive

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Process induced residual stresses in isotropically conductive adhesive joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part C ◽

10.1109/3476.558551 ◽

1996 ◽

Vol 19 (4) ◽

pp. 251-256 ◽

Author(s):

S.X. Wu ◽

Yuhai Mel ◽

Chao-Pin Yeh ◽

K.W. Wyatt

Keyword(s):

Residual Stresses ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive

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Electrical resistance modeling of isotropically conductive adhesive joints

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. ◽

10.1109/isse.2005.1491016 ◽

2005 ◽

Author(s):

M. Mundlein ◽

J. Nicolics

Keyword(s):

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive ◽

Resistance Modeling

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Electrical conduction models for isotropically conductive adhesive joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.558537 ◽

1997 ◽

Vol 20 (1) ◽

pp. 3-8 ◽

Author(s):

L. Li ◽

J.E. Morris

Keyword(s):

Electrical Conduction ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive

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Reliability Testing of Electrically Conductive Adhesive Joints for Surface Mount Printed-circuit-board

Journal of The Adhesion Society of Japan ◽

10.11618/adhesion.43.187 ◽

2007 ◽

Vol 43 (5) ◽

pp. 187-194

Author(s):

Hirokazu TANAKA

Keyword(s):

Printed Circuit Board ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Circuit Board ◽

Reliability Testing ◽

Electrically Conductive ◽

Surface Mount ◽

Printed Circuit ◽

Electrically Conductive Adhesive

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Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.774731 ◽

1999 ◽

Vol 22 (2) ◽

pp. 191-199 ◽

Author(s):

J.H. Constable ◽

T. Kache ◽

H. Teichmann ◽

S. Muhle ◽

M.A. Gaynes

Keyword(s):

Fatigue Life ◽

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Resistance Monitoring ◽

Pull Strength ◽

Isotropically Conductive Adhesive

Download Full-text