A contribution to program comprehension by program analysis: application to numerical programs

Author(s):  
Y. Ait-Ameur
1994 ◽  
Vol 4 (10) ◽  
pp. 1999-2012 ◽  
Author(s):  
Nabil Derbel ◽  
Mohamed B.A. Kamoun ◽  
Michel Poloujadoff

2010 ◽  
Vol 41 (01) ◽  
Author(s):  
HP Müller ◽  
A Unrath ◽  
A Riecker ◽  
AC Ludolph ◽  
J Kassubek

Author(s):  
Zeynep G. Saribatur ◽  
Thomas Eiter

The recently introduced notion of ASP abstraction is on reducing the vocabulary of a program while ensuring over-approximation of its answer sets, with a focus on having a syntactic operator that constructs an abstract program. It has been shown that such a notion has the potential for program analysis at the abstract level by getting rid of irrelevant details to problem solving while preserving the structure, that aids in the explanation of the solutions. We take here a further look on ASP abstraction, focusing on abstraction by omission with the aim to obtain a better understanding of the notion. We distinguish the key conditions for omission abstraction which sheds light on the differences to the well-studied notion of forgetting. We demonstrate how omission abstraction fits into the overall spectrum, by also investigating its behavior in the semantics of a program in the framework of HT logic.


2020 ◽  
Vol 2 (2) ◽  
Author(s):  
Suzanna Schmeelk ◽  
Lixin Tao

Many organizations, to save costs, are movinheg to t Bring Your Own Mobile Device (BYOD) model and adopting applications built by third-parties at an unprecedented rate.  Our research examines software assurance methodologies specifically focusing on security analysis coverage of the program analysis for mobile malware detection, mitigation, and prevention.  This research focuses on secure software development of Android applications by developing knowledge graphs for threats reported by the Open Web Application Security Project (OWASP).  OWASP maintains lists of the top ten security threats to web and mobile applications.  We develop knowledge graphs based on the two most recent top ten threat years and show how the knowledge graph relationships can be discovered in mobile application source code.  We analyze 200+ healthcare applications from GitHub to gain an understanding of their software assurance of their developed software for one of the OWASP top ten moble threats, the threat of “Insecure Data Storage.”  We find that many of the applications are storing personally identifying information (PII) in potentially vulnerable places leaving users exposed to higher risks for the loss of their sensitive data.


2013 ◽  
Vol 3 (1) ◽  
pp. 45-50
Author(s):  
Dwi Dian Praptanto ◽  
Kurnia Herlina Dewi ◽  
Bosman Sidebang

The purpose of this study is to examine the effect of drying time in weight and water content, combination effect of drying time and size of the material, and consumer acceptance to the product in the wet processing of chili blocks production. Method used in the research is completely randomized design (CRD) with two factorials are material size and drying time. Data were analyzed using ANOVA and further analysis using DMRT at 5% significance level. Organoleptic test result was analyzed using the Kruskal-Wallis and Tukey test for further analysis. Application of the equal drying time to two different size of material: rough and finest block chili, showed the result that water content of the rough block chili is lower than the finest block chilli. Application of the different drying time duration to the same size of chili showed the lower water content with increasing duration of drying time. The water content of the material tends to decrease with increasing duration of drying time. The level of consumer’s preferences to the product of wet processing of chili blocks production is equal for scents, but it’s different for color, texture and overall preferences.


Author(s):  
Bilal Abd-AlRahman ◽  
Corey Lewis ◽  
Todd Simons

Abstract A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.


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