Reduction of CMP μ-scratch induced metal shorts by introduction of a post CMP tungsten plasma clean process in a high volume DRAM manufacturing environment

Author(s):  
H. Ollendorf ◽  
S. Cabral ◽  
R. Fuller
2005 ◽  
Author(s):  
Jerry X. Chen ◽  
Maihan Nguyen ◽  
Osamu Arasaki ◽  
Tammy Maraquin ◽  
Daniel Sawyer ◽  
...  

2021 ◽  
Author(s):  
Fang Wei ◽  
Chenming Zhang ◽  
Honglin Meng ◽  
Zhihao Chu ◽  
Chao Huang ◽  
...  

Author(s):  
D. E. Fornwalt ◽  
A. R. Geary ◽  
B. H. Kear

A systematic study has been made of the effects of various heat treatments on the microstructures of several experimental high volume fraction γ’ precipitation hardened nickel-base alloys, after doping with ∼2 w/o Hf so as to improve the stress rupture life and ductility. The most significant microstructural chan§e brought about by prolonged aging at temperatures in the range 1600°-1900°F was the decoration of grain boundaries with precipitate particles.Precipitation along the grain boundaries was first detected by optical microscopy, but it was necessary to use the scanning electron microscope to reveal the details of the precipitate morphology. Figure 1(a) shows the grain boundary precipitates in relief, after partial dissolution of the surrounding γ + γ’ matrix.


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