Manufacturing Process Optimization of Polycrystaline Aluminum and Aluminum Alloy on SiO2/Si

Author(s):  
Ping Linda Zhang ◽  
Ping Huang ◽  
Zhongyuan Jin ◽  
C. C. Han
Procedia CIRP ◽  
2021 ◽  
Vol 96 ◽  
pp. 57-62
Author(s):  
Alexios Papacharalampopoulos ◽  
Harry Bikas ◽  
Christos Michail ◽  
Panagiotis Stavropoulos

Author(s):  
Agus Sudianto ◽  
Zamberi Jamaludin ◽  
Azrul Azwan Abdul Rahman ◽  
Sentot Novianto ◽  
Fajar Muharrom

Manufacturing process of metal part requires real-time temperature monitoring capability to ensure high surface integrity is upheld throughout the machining process. A smart temperature measurement and monitoring system for manufacturing process of metal parts is necessary to meet quality and productivity requirements. A smart temperature measurement can be applied in machining processes of conventional, non-conventional and computer numerical control (CNC) machines. Currently, an infrared fusion based thermometer Fluke Ti400 was employed for temperature measurement in a machining process. However, measured temperature in the form of data list with adjustable time range setting is not automatically linked to the computer for continuous monitoring and data analysis purposes. For this reason, a smart temperature measurement system was developed for a CNC milling operation on aluminum alloy (AA6041) using a MLX90614 infrared thermometer sensor operated by Arduino. The system enables data linkages with the computer because MLX90614 is compatible and linked to Microsoft Exel via the Arduino. This paper presents a work-study on the performance of this Arduino based temperature measurement system for dry milling process application. Here, the Arduino based temperature measurement system captured the workpiece temperature during machining of Aluminum Alloy (AA6041) and data were compared with the Fluke Ti400 infrared thermometer. Measurement results from both devices showed similar accuracy level with a deviation of ± 2 oC. Hence, a smart temperature measurement system was succeesfully developed expanding the scopes of current system setup.


2021 ◽  
Vol MA2021-01 (2) ◽  
pp. 192-192
Author(s):  
Marc Duquesnoy ◽  
Elixabete Ayerbe ◽  
Iker Boyano ◽  
Alejandro A. Franco

2016 ◽  
Vol 10 (3) ◽  
pp. 315-321 ◽  
Author(s):  
M. Y. Hu ◽  
J. J. Cai ◽  
W. L. Sun ◽  
H. Y. Jiang ◽  
Y. Y. Sang ◽  
...  

2002 ◽  
Vol 01 (02) ◽  
pp. 201-210 ◽  
Author(s):  
PATRICK E. DESSERT ◽  
SCOTT D. JAMES

We have applied the principles of chaos theory to optimizing the manufacturing process. A simulation system was created in which multiple parameters were modified to denote the effect of chaotic changes on the net profit derived. The companies that are successful in modeling their manufacturing systems in a simplistic manner can look forward to increased profit, better control and simpler manufacturing systems. Finding and selecting the correct set of parameters to subject to chaotic changes is time consuming. There are countless operating parameters that could be selected and the interaction of those parameters may have varying degrees of success on trying to optimize the manufacturing process. Certain parametric interactions may increase revenue, while other interactions may actually do the inverse.


Author(s):  
A. Moreno ◽  
E. Graycochea Jr. ◽  
F. R. Gomez

One of the most challenging assembly manufacturing process in semiconductor industry is wirebond process using a wire as direct material. With this new technology, some issues were encountered during the first trial of a quad flat no-leads (QFN) package. This paper is focused on the heal crack seen on the stitch formation during second bond. A comprehensive improvement was done by relocating the stitch formation on the second bond. Ultimately, heal crack occurrence was successfully eliminated.


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