Transformer-based Alarm Context-Vectorization Representation for Reliable Alarm Root Cause Identification in Optical Networks

Author(s):  
Jinwei Jia ◽  
Danshi Wang ◽  
Chunyu Zhang ◽  
Hui Yang ◽  
Luyao Guan ◽  
...  
Author(s):  
J. N. C. de Luna ◽  
M. O. del Fierro ◽  
J. L. Muñoz

Abstract An advanced flash bootblock device was exceeding current leakage specifications on certain pins. Physical analysis showed pinholes on the gate oxide of the n-channel transistor at the input buffer circuit of the affected pins. The fallout contributed ~1% to factory yield loss and was suspected to be caused by electrostatic discharge or ESD somewhere in the assembly and test process. Root cause investigation narrowed down the source to a charged core picker inside the automated test equipment handlers. By using an electromagnetic interference (EMI) locator, we were able to observe in real-time the high amplitude electromagnetic pulse created by this ESD event. Installing air ionizers inside the testers solved the problem.


Author(s):  
Peter Egger ◽  
Stefan Müller ◽  
Martin Stiftinger

Abstract With shrinking feature size of integrated circuits traditional FA techniques like SEM inspection of top down delayered devices or cross sectioning often cannot determine the physical root cause. Inside SRAM blocks the aggressive design rules of transistor parameters can cause a local mismatch and therefore a soft fail of a single SRAM cell. This paper will present a new approach to identify a physical root cause with the help of nano probing and TCAD simulation to allow the wafer fab to implement countermeasures.


2021 ◽  
Author(s):  
Saniya Karnik ◽  
Navya Yenuganti ◽  
Bonang Firmansyah Jusri ◽  
Supriya Gupta ◽  
Prasanna Nirgudkar ◽  
...  

Abstract Today, Electrical Submersible Pump (ESP) failure analysis is a tedious, human-intensive, and time-consuming activity involving dismantle, inspection, and failure analysis (DIFA) for each failure. This paper presents a novel artificial intelligence workflow using an ensemble of machine learning (ML) algorithms coupled with natural language processing (NLP) and deep learning (DL). The algorithms outlined in this paper bring together structured and unstructured data across equipment, production, operations, and failure reports to automate root cause identification and analysis post breakdown. This process will result in reduced turnaround time (TAT) and human effort thus drastically improving process efficiency.


Author(s):  
Anqi Zhang ◽  
Yihai He ◽  
Chengcheng Wang ◽  
Jishan Zhang ◽  
Zixuan Zhang

Reliability is reflected in product during manufacturing. However, due to uncontrollable factors during production, product reliability may degrade substantially after manufacturing. Thus, root cause analysis is important in identifying vulnerable parameters to prevent the product reliability degradation in manufacturing. Therefore, a novel root cause identification approach based on quality function deployment (QFD) and extended risk priority number (RPN) is proposed to prevent the degradation of product manufacturing reliability. First, the connotation of product manufacturing reliability and its degradation mechanism are expounded. Second, the associated tree of the root cause of product manufacturing reliability degradation is established using the waterfall decomposition of QFD. Third, the classic RPN is extended to focus on importance to reliability characteristics, probability, and un-detectability. Furthermore, fuzzy linguistic is adopted and the integrated RPN is calculated to determine the risk of root causes. Therefore, a risk-oriented root cause identification technique of product manufacturing reliability degradation is proposed using RPN. Finally, a root cause identification of an engine component is presented to verify the effectiveness of this method. Results show that the proposed approach can identify the root cause objectively and provide reference for reliability control during production.


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