Advanced HiCTE ceramic flip-chipping of 90nm Cu/low-k device: a novel material, package structure, and process optimization study

Author(s):  
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F.G. Shi
2010 ◽  
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pp. 4361-4367 ◽  
Author(s):  
Siew Hoong Shuit ◽  
Keat Teong Lee ◽  
Azlina Harun Kamaruddin ◽  
Suzana Yusup

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Author(s):  
Ting Chen ◽  
Douglas Van Den Broeke ◽  
Sean Park ◽  
Armin Liebchen ◽  
J. Fung Chen ◽  
...  

2021 ◽  
Vol 24 ◽  
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Enyonam Ahadzi ◽  
M.S Ramyashree ◽  
S. Shanmuga Priya ◽  
K. Sudhakar ◽  
Muhammad Tahir

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