Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

2017 ◽  
Author(s):  
Mohammed Genanu ◽  
Francis Mutuku ◽  
Eric J Cotts ◽  
James Wilcox ◽  
Babak Arfaei ◽  
...  
Keyword(s):  
Solder Joints ◽  
Mechanical Reliability ◽  
Processing Variables ◽  
Snag Solder

scholarly journals Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

RSC Advances ◽  
2020 ◽  
Vol 10 (66) ◽  
pp. 40215-40224
Author(s):  
Angela De Rose ◽  
Gabriele Mikolasch ◽  
Mathias Kamp ◽  
Achim Kraft ◽  
Mathias Nowottnick
Keyword(s):  
Solder Joints ◽  
Ambient Air ◽  
Mechanical Reliability ◽  
Term Stability ◽  
Long Term Stability

High mechanical reliability of tin-based solder joints processed by joining copper and nickel-coated aluminium with short soldering times in ambient air.

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

2018 ◽  
Vol 47 (7) ◽  
pp. 4165-4169 ◽  
Author(s):  
Yong-Gue Sung ◽  
Woo-Ram Myung ◽  
Haksan Jeong ◽  
Min-Kwan Ko ◽  
Jeonghoon Moon ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Mechanical Reliability ◽  
Surface Finishes

Life Prediction of SnPb and SnAg Solder Joints in PBGA Packages Using a Severity Metric

2003 ◽  
Author(s):  
Donghyun Kim ◽  
Andrew Mawer ◽  
Tess J. Moon ◽  
Glenn Y. Masada
Keyword(s):  
Life Prediction ◽  
Solder Joints ◽  
Mean Value ◽  
Printed Wiring Board ◽  
Geometric Configurations ◽  
Design And Manufacturing ◽  
Creep Time ◽  
Snag Solder ◽  
Wiring Board ◽  
Life Predictions

A severity metric is developed to predict the life of SnPb and SnAg solder joints in PBGA packages by quantitatively estimating the changes in damage arising from different board configurations and accelerated thermal cycle tests (ATC). Damage measures include time-dependent creep, time-independent plastic deformation, and an effective stress that is computed from the ATC parameters of temperatures, dwell-time, and ramp rates and from package geometries on the printed wiring board. Life prediction using this severity metric has been applied to 24 sets of test data on SnPb and SnAg solder joints in 357-PBGA packages and include three post-processing conditions (aged at 150/160°C, quenched at 0°C, and air-cooled), three ATC test conditions (0–100°C, −40–125°C, and −55–125°C), and four package-on-board geometric configurations. Statistical analysis is provided to compare the life predictions based upon the severity metric and from ATC testing—predicted joint life is well within one standard deviation of the experimental mean value of life for most of the 24 cases. The severity metric can be used to quantify the effects of design and manufacturing choices on joint life.

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

2015 ◽  
Vol 138 (1) ◽  
Author(s):  
Shugo Miyake ◽  
Kohei Ohtani ◽  
Shozo Inoue ◽  
Takahiro Namazu
Keyword(s):  
Fracture Surface ◽  
Fracture Strength ◽  
Solder Joints ◽  
Exothermic Reaction ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Reaction Bonding ◽  
Surface Observation ◽  
Four Point Bending ◽  
Snag Solder

Self-propagating exothermic reaction bonding (SERB) technique with Al/Ni multilayer film is fascinating in the viewpoint of lots of outstanding features, such as atmosphere-independent exothermic reaction and its self-propagation. The reactively bonded solder joints with high bonded strength are required for practical use in semiconductor devices. We have investigated the fracture strength of rectangular-solid specimens with reactively bonded solder joint (Sn–3.5Ag solder/reacted NiAl/Sn–3.5Ag solder) sandwiched by single crystal silicon (SCS). In this paper, the influence of bonding atmosphere on the fracture behavior is discussed by means of four-point bending testing and fracture surface observation. The fracture strength increases with increasing pressure load during bonding. The strength of the vacuum-bonded specimens is found to be higher than that of the air-bonded specimens. The fracture surface observation results suggest that Al oxide and intermetallic compounds (IMCs) formed at the reacted NiAl layer and the SnAg solder layer, respectively, would have affected the strength of the Al/Ni SERB joints.

J211021 Mechanical reliability of solder-joints bonded with self-propagating exothermic materials

2013 ◽  
Vol 2013 (0) ◽  
pp. _J211021-1-_J211021-3
Author(s):  
Takahiro NAMAZU ◽  
Kohei OHTANI ◽  
Masayuki FUJII ◽  
Shozo INOUE
Keyword(s):  
Solder Joints ◽  
Mechanical Reliability ◽  
Reliability Of Solder Joints

scholarly journals Effects of voids on thermal-mechanical reliability of lead-free solder joints

2014 ◽  
Vol 12 ◽  
pp. 04026 ◽  
Author(s):  
Lahouari Benabou ◽  
Van Nhat Le ◽  
Zhidan Sun ◽  
Philippe Pougnet ◽  
Victor Etgens
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Reliability ◽  
Free Solder

Effects of Ag addition and Ag 3 Sn formation on the mechanical reliability of Ni/Sn solder joints

2017 ◽  
Vol 75 ◽  
pp. 53-58
Author(s):  
Kunmo Chu ◽  
Changseung Lee ◽  
Sung-Hoon Park ◽  
Yoonchul Sohn
Keyword(s):  
Solder Joints ◽  
Mechanical Reliability ◽  
Ag Addition

Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations

2013 ◽  
Vol 53 (12) ◽  
pp. 2012-2017 ◽  
Author(s):  
Chin-Hung Kuo ◽  
Hsin-Hui Hua ◽  
Ho-Yang Chan ◽  
Tsung-Hsun Yang ◽  
Kuen-Song Lin ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Surface Finish ◽  
Solder Joints ◽  
Mechanical Reliability

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

1992 ◽  
Vol 114 (1) ◽  
pp. 88-92 ◽  
Author(s):  
Yifan Guo ◽  
Charles G. Woychik
Keyword(s):  
Thermal Expansion ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Low Cycle Fatigue ◽  
Thermal Strain ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Mechanical Reliability ◽  
Surface Mount ◽  
Inherent Strength

Low cycle fatigue of solder joints is one of the major kinds of failures in second level interconnections of an electronic package. The fatigue failure is caused by thermal strains which are created from a mismatch of coefficients of thermal expansion (CTE) that occurs between two levels of packaging. As the package approaches smaller dimensions, measurements of thermal strains in the solder interconnections become very difficult. In this paper, moire interferometry technique was applied to evaluate the thermal strains in the second level interconnections for both conventional pin-in-hole (PIH) packages and surface mount components. The coefficient of thermal expansion of each component was measured. Thermal strain distributions in the solder interconnections were determined, and reliability issues were discussed. The strains in solder joints of the PIH components were much higher than those of the stacked surface mount components. Even though the surface mount components had a lower inherent strength, their overall mechanical reliability was much higher since they had practically no localized strain concentrations.

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