Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-Time Moiré Interferometry

2018 ◽  
Author(s):  
Bulong Wu ◽  
Bongtae Han
Keyword(s):  
Experimental Study ◽  
Mechanical Behavior ◽  
Real Time ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Wafer Level ◽  
Wafer Level Package

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

2003 ◽  
Vol 125 (2) ◽  
pp. 282-288 ◽  
Author(s):  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Real Time ◽  
Room Temperature ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Wafer Level ◽  
Element Analysis ◽  
The Real ◽  
Thermal Chamber

In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire´ interferometry. One is a thermal load from 100°C to room temperature and the other is from room temperature to 100°C. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical window was developed. In addition, the test results obtained from the moire´ interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests.

scholarly journals Real-time optical differentiation for moire interferometry

1987 ◽  
Vol 26 (10) ◽  
pp. 1977 ◽  
Author(s):  
Krzysztof Patorski ◽  
Daniel Post ◽  
Robert Czarnek ◽  
Yifan Guo
Keyword(s):  
Real Time ◽  
Moiré Interferometry ◽  
Moire Interferometry

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

1998 ◽  
Vol 120 (2) ◽  
pp. 160-165 ◽  
Author(s):  
J. Zhu ◽  
D. Zou ◽  
S. Liu
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Real Time ◽  
Electronic Packaging ◽  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Plastic Package ◽  
Highly Nonlinear ◽  
Fringe Patterns

Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits uneven thermal deformation in the whole temperature range during thermal cycling. This behavior will affect the buildup of thermal strain/stress within the package, which may affect the reliability of the package. Therefore, a real-time method is needed to monitor the thermal deformation of packages during the thermal cycling. In this study, a real-time moire´ interferometry technique coupled with a thermal vacuum chamber is used to monitor the thermal deformation of a plastic package. A grating is transferred onto the cross section of the sample at room temperature. The fringe patterns are recorded by a CCD camera system and are compared with the displacement contours obtained by nonlinear finite element simulation. High temperature moire´ results up to 200°C are reported here. The comparison between the moire´ fringe patterns and finite element results shows a good agreement. The results also show that the real-time moire´ interferometry technique is an effective way to monitor the thermal deformation of electronic packaging and is a powerful validation method for finite element analysis.

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