System Level Power Integrity Analysis with Physics-Based Modeling Methodology

Author(s):  
Biyao Zhao ◽  
Siqi Bai ◽  
Samuel Connor ◽  
Matteo Cecchini ◽  
Dale Becker ◽  
...  
2020 ◽  
Vol 62 (4) ◽  
pp. 1266-1277 ◽  
Author(s):  
Biyao Zhao ◽  
Siqi Bai ◽  
Samuel Connor ◽  
Wiren Dale Becker ◽  
Matteo Cocchini ◽  
...  

Author(s):  
Wu Yang ◽  
Xin He ◽  
Jun Deng ◽  
Keliu Hu ◽  
Kun Huang ◽  
...  

Energies ◽  
2019 ◽  
Vol 12 (21) ◽  
pp. 4173
Author(s):  
Zehua Dai ◽  
Li Wang ◽  
Lexuan Meng ◽  
Shanshui Yang ◽  
Ling Mao

The transportation sector is undergoing electrification to gain advantages such as lighter weight, improved reliability, and enhanced efficiency. As contributors to the safety of embedded critical functions in electrified systems, better sizing of electric machines in vehicles is required to reduce the cost, volume, and weight. Although the designs of machines are widely investigated, existing studies are mostly complicated and application-specific. To satisfy the multi-level design requirements of power systems, this study aims to develop an efficient modeling method of electric machines with a background of aircraft applications. A variable-speed variable-frequency (VSVF) electrically excited synchronous generator is selected as a case study to illustrate the modular multi-physics modeling process, in which weight and power loss are the major optimization goals. In addition, multi-disciplinary design optimization (MDO) methods are introduced to facilitate the optimal variable selection and simplified model establishment, which can be used for the system-level overall design. Several cases with industrial data are analyzed to demonstrate the effectiveness and superior performance of the modeling method. The results show that the proposed practices provide designers with accurate, fast, and systematic means to develop models for the efficient design of aircraft power systems.


Author(s):  
Jeff Chen ◽  
Weiping Li ◽  
Feng Ling

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.


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