Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems

Author(s):  
Pei-Yang Weng ◽  
Chi-Hsuan Cheng ◽  
Tzong-Lin Wu ◽  
Carol Chen ◽  
James Chen ◽  
...  
Electronics ◽  
2021 ◽  
Vol 10 (12) ◽  
pp. 1399
Author(s):  
Taepyeong Kim ◽  
Sangun Park ◽  
Yongbeom Cho

In this study, a simple and effective memory system required for the implementation of an AI chip is proposed. To implement an AI chip, the use of internal or external memory is an essential factor, because the reading and writing of data in memory occurs a lot. Those memory systems that are currently used are large in design size and complex to implement in order to handle a high speed and a wide bandwidth. Therefore, depending on the AI application, there are cases where the circuit size of the memory system is larger than that of the AI core. In this study, SDRAM, which has a lower performance than the currently used memory system but does not have a problem in operating AI, was used and all circuits were implemented digitally for simple and efficient implementation. In particular, a delay controller was designed to reduce the error due to data skew inside the memory bus to ensure stability in reading and writing data. First of all, it verified the memory system based on the You Only Look Once (YOLO) algorithm in FPGA to confirm that the memory system proposed in AI works efficiently. Based on the proven memory system, we implemented a chip using Samsung Electronics’ 65 nm process and tested it. As a result, we designed a simple and efficient memory system for AI chip implementation and verified it with hardware.


2021 ◽  
Vol 16 (5) ◽  
pp. 773-780
Author(s):  
Bing-Jie Li ◽  
Zhen-Song Li ◽  
Yan-Ping Zhao ◽  
Zheng-Wang Li ◽  
Min Miao

The signal integrity (SI) analysis of a high-speed signal interconnect channel composed of through silicon vias (TSVs) and horizontal re-distribution layers (RDL) is carried out, and the problems of SI, such as transmission loss, crosstalk and coupling effect in the transmission channel, are analyzed and studied. These signal integrity issues are considered in this paper, a signal interconnect channel model is proposed and the equivalent circuit model is deduced as well. Compared with the traditional one, this interconnect channel model has better performance in SI. Further sweep frequency analysis is carried out for different material parameters to achieve signal transmission performance optimization aimed at this model. Test samples of the proposed signal interconnect channel model are designed and fabricated according to the process index, and measured to verify the actual transmission performance. The design and optimization rule of high-speed signal interconnect channel are summarized which proved that the proposed structure has more advantages in signal transmission performance, and has important guiding significance for practical design.


2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

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