Numerical study on impact of mechanical stress in the regions of high current density in N-Type MOS devices

Author(s):  
Masaaki Koganemaru ◽  
Naohiro Tada ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki ◽  
Hajime Tomokage
Author(s):  
Yuichiro Tabuchi ◽  
Takeshi Shiomi ◽  
Osamu Aoki ◽  
Norio Kubo ◽  
Kazuhiko Shinohara

Heat and water transport in polymer electrolyte membrane fuel cell (PEMFC) has considerable impacts on cell performance under high current density which is desired in PEMFC for automobiles. In this study, the impact of rib/channel, heat and water transport on cell performance under high current density was investigated by experimental evaluation of liquid water distribution and numerical validation. Liquid water distribution between rib and channel is evaluated by Neutron Radiography. In order to neglect the effect of liquid water in channel and the distribution of oxygen and hydrogen concentration distribution along with channel length, the differential cell was used in this study. Experimental results show that liquid water under channel was dramatically changed with Rib/Channel width. From numerical study, it is found that the change of liquid water distribution was strongly affected by temperature distribution between rib and channel. In addition, not only heat transport but also water transport through membrane also significantly affected cell performance under high current density operation. From numerical validation, it is concluded that this effect on cell performance under high current density could be due to the enhancement of back-diffusion of water through membrane.


1994 ◽  
Vol 356 ◽  
Author(s):  
S. Pramanick ◽  
D. D. Brown ◽  
V. Pham ◽  
P. Besser ◽  
J. Sanchez ◽  
...  

AbstractThe electromigration failure mode and failure rate during accelerated electromigration testing is expected to be strongly affected by the mechanical stress state of Al lines, since tensile stress and compressive stress states favor void growth and hillock formations (extrusions), respectively. During electromigration testing, the mechanical stress state or evolution of mechanical stress of an interconnect is a function of current density and temperature, the two principal variables in electromigration testing. In our experiments, we have observed two different electromigration failure modes by varying the current density and temperatures where (i) the passivated Al lines tested at high current density and high temperatures failed by extrusion or hillock type failure and (ii) the interconnect lines tested at low current density and moderate temperature failed by voiding. A mechanical stress model which incorporates both the thermally generated stress and electromigration induced mechanical stress is invoked to explain the electromigration failure mode selection observed in our experiments.


Author(s):  
Yingchun Zhang ◽  
Changsheng Cao ◽  
Xintao Wu ◽  
Qi-Long Zhu

Bismuth (Bi)-based nanomaterials are considered as the promising electrocatalysts for electrocatalytic CO2 reduction reaction (CO2RR), but it is challenging to achieve high current density and selectivity in a wide potential...


Author(s):  
Xia He ◽  
Fei Yan ◽  
Mingyuan Gao ◽  
Yunjing Shi ◽  
Guanglong Ge ◽  
...  

Author(s):  
Anand Abhishek ◽  
Niraj Kumar ◽  
Udit Narayan Pal ◽  
Bhim Singh ◽  
S. A. Akbar

Author(s):  
Alan M. Cook ◽  
Edward L. Wright ◽  
Khanh T. Nguyen ◽  
Colin D. Joye ◽  
John C. Rodgers ◽  
...  

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