scholarly journals Characterization and design of sequential circuit elements to combat soft error

Author(s):  
Hamed Abrishami ◽  
Safar Hatami ◽  
Massoud Pedram
2015 ◽  
Vol 15 (2) ◽  
pp. 168-176
Author(s):  
Shuo Cai ◽  
Ji-Shun Kuang ◽  
Tie-Qiao Liu ◽  
Wei-Zheng Wang

Author(s):  
Ahmed K. Jameil ◽  
Yasir Amer Abbas ◽  
Saad Al-Azawi

Background: The designed circuits are tested for faults detection in fabrication to determine which devices are defective. The design verification is performed to ensure that the circuit performs the required functions after manufacturing. Design verification is regarded as a test form in both sequential and combinational circuits. The analysis of sequential circuits test is more difficult than in the combinational circuit test. However, algorithms can be used to test any type of sequential circuit regardless of its composition. An important sequential circuit is the finite impulse response (FIR) filters that are widely used in digital signal processing applications. Objective: This paper presented a new design under test (DUT) algorithm for 4-and 8-tap FIR filters. Also, the FIR filter and the proposed DUT algorithm is implemented using field programmable gate arrays (FPGA). Method: The proposed test generation algorithm is implemented in VHDL using Xilinx ISE V14.5 design suite and verified by simulation. The test generation algorithm used FIR filtering redundant faults to obtain a set of target faults for DUT. The fault simulation is used in DUT to assess the benefit of test pattern in fault coverage. Results: The proposed technique provides average reductions of 20 % and 38.8 % in time delay with 57.39 % and 75 % reductions in power consumption and 28.89 % and 28.89 % slices reductions for 4- and 8-tap FIR filter, respectively compared to similar techniques. Conclusions: The results of implementation proved that a high speed and low power consumption design can be achieved. Further, the speed of the proposed architecture is faster than that of existing techniques.


2020 ◽  
Vol 114 ◽  
pp. 113856
Author(s):  
Germán León ◽  
José M. Badía ◽  
Jose A. Belloch ◽  
Almudena Lindoso ◽  
Luis Entrena

Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1572
Author(s):  
Ehab A. Hamed ◽  
Inhee Lee

In the previous three decades, many Radiation-Hardened-by-Design (RHBD) Flip-Flops (FFs) have been designed and improved to be immune to Single Event Upsets (SEUs). Their specifications are enhanced regarding soft error tolerance, area overhead, power consumption, and delay. In this review, previously presented RHBD FFs are classified into three categories with an overview of each category. Six well-known RHBD FFs architectures are simulated using a 180 nm CMOS process to show a fair comparison between them while the conventional Transmission Gate Flip-Flop (TGFF) is used as a reference design for this comparison. The results of the comparison are analyzed to give some important highlights about each design.


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