Optimizing process conditions using design of experiments - A wire bonding, semiconductor assembly process case study

Author(s):  
Xiaoying Wang ◽  
Chee-Cheng Chen
2014 ◽  
Vol 6 (2) ◽  
pp. 25-28
Author(s):  
Frank Maker ◽  
Rajeevan Amirtharajah ◽  
Venkatesh Akella

Author(s):  
Jorge Armando Ardila ◽  
Benedito Roberto de Alvarenga Junior ◽  
Luis Cuadrado Durango ◽  
Frederico Luis Felipe Soares ◽  
Bruno Perlatti ◽  
...  

2012 ◽  
Vol 428 ◽  
pp. 33-37
Author(s):  
Yi Min Deng ◽  
Bao Shou Sun ◽  
Hua Bo He ◽  
Fu Zhan Shangguan

Injection moulding is an important manufacturing method for plastic parts. There are however many moulding quality defects caused by inappropriate setting of moulding process conditions, as well as the poorly designed plastic part geometry. Often, stiffeners are used in a plastic part to increase its strength. However, if the stiffeners are not designed properly, they will introduce one or more moulding quality problems, which in turn will worsen the part strength rather than increasing it. Although there have been quite a lot of researches on optimising moulding quality, it is often difficult to minimize multiple quality defects simultaneously. In this paper, we propose to employ flow uniformity as the optimisation objective to address this problem. A number of stiffener layout designs are evaluated in terms of this objective to determine the best design, where standard deviations of filling times and pressures at the extremities of the plastic part are used to measure the uniformity of flow. A simple case study is also presented to demonstrate the applicability of the proposed methodology.


2017 ◽  
Vol 8 (4) ◽  
pp. 1309 ◽  
Author(s):  
Abdur Rahman ◽  
Salaha Uddin Chowdhury Shaju ◽  
Sharan Kumar Sarkar ◽  
Mohammad Zahed Hashem ◽  
S. M. Kamrul Hasan ◽  
...  

This paper demonstrates the empirical application of Six Sigma and Define-Measure-Analyze-Improve-Control (DMAIC) methodology to reduce product defects within a garments manufacturing organization in Bangladesh which follows the DMAIC methodology to investigate defects, root causes and provide a solution to eliminate these defects. The analysis from employing Six Sigma and DMAIC indicated that the broken stitch and open seam influenced the number of defective products. Design of experiments (DOE) and the analysis of variance (ANOVA) techniques were combined to statistically determine the correlation of the broken stitch and open seam with defects as well as to define their optimum values needed to eliminate the defects. Thus, a reduction of about 35% in the garments defect was achieved, which helped the organization studied to reduce its defects and thus improve its Sigma level from 1.7 to 3.4.


Author(s):  
Antonio Sumagpang Jr. ◽  
Frederick Ray Gomez

The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned for the short contact test. Design of experiments (DOE) on assembly processes were conducted and eventually identified the reject as an electrostatic discharge (ESD) related failure. Corrective actions and ESD controls significantly reduced the occurrence of damaged metallization with around 85% reduction.


Sign in / Sign up

Export Citation Format

Share Document