Heterogeneous integration of III–V on Silicon based microlaser sources for photonic integrated circuit applications

Author(s):  
Pedro Rojo Romeo ◽  
Lydie Ferrier ◽  
Fabien Mandorlo ◽  
Xavier Letartre ◽  
Pierre Viktorovitch ◽  
...  
Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1646
Author(s):  
Jingya Xie ◽  
Wangcheng Ye ◽  
Linjie Zhou ◽  
Xuguang Guo ◽  
Xiaofei Zang ◽  
...  

In the last couple of decades, terahertz (THz) technologies, which lie in the frequency gap between the infrared and microwaves, have been greatly enhanced and investigated due to possible opportunities in a plethora of THz applications, such as imaging, security, and wireless communications. Photonics has led the way to the generation, modulation, and detection of THz waves such as the photomixing technique. In tandem with these investigations, researchers have been exploring ways to use silicon photonics technologies for THz applications to leverage the cost-effective large-scale fabrication and integration opportunities that it would enable. Although silicon photonics has enabled the implementation of a large number of optical components for practical use, for THz integrated systems, we still face several challenges associated with high-quality hybrid silicon lasers, conversion efficiency, device integration, and fabrication. This paper provides an overview of recent progress in THz technologies based on silicon photonics or hybrid silicon photonics, including THz generation, detection, phase modulation, intensity modulation, and passive components. As silicon-based electronic and photonic circuits are further approaching THz frequencies, one single chip with electronics, photonics, and THz functions seems inevitable, resulting in the ultimate dream of a THz electronic–photonic integrated circuit.


2015 ◽  
Vol 1 (8) ◽  
pp. e1500257 ◽  
Author(s):  
Chuang Zhang ◽  
Chang-Ling Zou ◽  
Yan Zhao ◽  
Chun-Hua Dong ◽  
Cong Wei ◽  
...  

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.


2021 ◽  
Author(s):  
Almir Wirth Lima Junior ◽  
Wilton Bezerra-Fraga

Abstract We are presenting graphene-based Binary Phase Shift Keying (BPSK) and Quadrature Phase Shift Keying (QPSK) modulators, which can operate in the range from the TeraHertz up to the infrared. It is noteworthy that these devices have huge advantages over the silicon Mach-Zehnder optical modulators (MZMs) with lateral PN-junction ribwaveguide phase shifters. Among the countless advantages, we can mention, for example, that these modulators consist of only one waveguide and have a much simpler application system of the modulator signal (gate voltage) than in silicon-based MZMs. Other huge advantages are greater efficiency, and yet, they are cheaper and have shorter lengths (and consequently, greater integration in photonic integrated circuit (PIC)). The first step to present these modulators was to detail the graphene theory that is involved in this device. After this step, we show the project, numerical simulations, and analyses related to our graphene-based BPSK and QPSK modulators. We believe that these modulators will contribute to the generation of new devices made up of 2D materials, which should revolutionize this area of science.


Author(s):  
José Capmany ◽  
Daniel Pérez

Programmable Integrated Photonics (PIP) is a new paradigm that aims at designing common integrated optical hardware configurations, which by suitable programming can implement a variety of functionalities that, in turn, can be exploited as basic operations in many application fields. Programmability enables by means of external control signals both chip reconfiguration for multifunction operation as well as chip stabilization against non-ideal operation due to fluctuations in environmental conditions and fabrication errors. Programming also allows activating parts of the chip, which are not essential for the implementation of a given functionality but can be of help in reducing noise levels through the diversion of undesired reflections. After some years where the Application Specific Photonic Integrated Circuit (ASPIC) paradigm has completely dominated the field of integrated optics, there is an increasing interest in PIP justified by the surge of a number of emerging applications that are and will be calling for true flexibility, reconfigurability as well as low-cost, compact and low-power consuming devices. This book aims to provide a comprehensive introduction to this emergent field covering aspects that range from the basic aspects of technologies and building photonic component blocks to the design alternatives and principles of complex programmable photonics circuits, their limiting factors, techniques for characterization and performance monitoring/control and their salient applications both in the classical as well as in the quantum information fields. The book concentrates and focuses mainly on the distinctive features of programmable photonics as compared to more traditional ASPIC approaches.


Author(s):  
Sarvagya Dwivedi ◽  
Jon Kjellman ◽  
Tangla David ◽  
Mathias Prost ◽  
Olga Syshchyk ◽  
...  

Author(s):  
Paul Verrinder ◽  
Lei Wang ◽  
Joseph Fridlander ◽  
Fengqiao Sang ◽  
Victoria Rosborough ◽  
...  

1994 ◽  
Vol 6 (8) ◽  
pp. 960-962 ◽  
Author(s):  
J.-M. Verdiell ◽  
T.L. Koch ◽  
B.I. Miller ◽  
M.E. Young ◽  
U. Koren ◽  
...  

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 599
Author(s):  
Jerry R. Meyer ◽  
Chul Soo Kim ◽  
Mijin Kim ◽  
Chadwick L. Canedy ◽  
Charles D. Merritt ◽  
...  

We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.


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