Statistical data pre-processing for fuzzy modeling of semiconductor manufacturing process

Author(s):  
R.L. Chen ◽  
C.J. Spanos
Author(s):  
Anqi Qiu ◽  
William Lowe ◽  
Mridul Arora

Abstract Nanoprobing systems have evolved to meet the challenges from recent innovations in the semiconductor manufacturing process. This is demonstrated through an exhibition of standard SRAM measurements on TSMC 7 nm FinFET technology. SEM based nanoprober is shown to meet or exceed the requirements for measuring 7nm technology and beyond. This paper discusses in detail of the best-known methods for nanoprobing on 7nm technology.


RSC Advances ◽  
2015 ◽  
Vol 5 (126) ◽  
pp. 103901-103906 ◽  
Author(s):  
Fuyun He ◽  
Zhisheng Zhang

In semiconductor manufacturing, the multilayer overlay lithography process is a typical multistage manufacturing process; one of the key factors that restrict the reliability and yield of integrated circuit chips is overlay error between the layers.


Author(s):  
Irena Łącka

Polish food industry challenges result from current and future changes in world’s economy i.e. the need of the optimization of manufacturing process, the increase of effectiveness of the use of resources, solving the personnel problems together and implementing innovations and technical progress. The aim of the article was to present the innovative activity of companies of this sector in years 2010-2016 with indicating tendencies in this scope. The analysis of investments in machines and devices aimed at evaluation of condition and prospects of technical progress of entities in food industry. The research has shown that the majority of this sector is weakly prepared to facing the challenges of new economy. This is indicated by low expenditures into the innovative activity of entities, the structure of those expenditures as well as results of activities during examined period. The analysis of the statistical data have shown that during this tested time the producers of food products and beverages have increased their investment in machines and devices in order to increase their effectiveness of the use of resources and modernize their machinery. During the research following methods were used: study of national and foreign literature, comparative analysis and elements of descriptive statistics. To analyze the innovative activity and investments of entities in machines and devices the data of public statistics was used.


2010 ◽  
Vol 126-128 ◽  
pp. 867-872
Author(s):  
Jian Long Kuo ◽  
Chun Cheng Kuo

Since the solder residue is essential in the semiconductor manufacturing process, it has great impact on the flip chip quality considerably. This paper intends to improve the flip chip quality and try to obtain an optimal solution for the system parameters in the flip chip manufacturing process. The SMT manufacturing process is studied for discussion. The amount of solder and the size of solder are selected as the two quality properties. During the flux cleaning process, many solders are left on the passive component side. The balling might flow into the chip. It will cause the bump short in the chip which will affect the quality of the flip chip severely. In this paper, response surface method is adopted as the design of experiments. The objective function and subjective constrained conditions are defined to formulate the optimization problem. The confirmation experimental results are also provided to prove the validity. It is believed that the optimization results are helpful to the improvement of the semiconductor manufacturing process.


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