scholarly journals Investigation of collecting conditions for determination of arsine in working environment of semiconductor manufacturing process.

1991 ◽  
Vol 40 (3) ◽  
pp. 149-152 ◽  
Author(s):  
Michie KOYAMA ◽  
Syokichi CHAKI ◽  
Manabu YAMAMOTO ◽  
Takahiro KUMAMARU
Keyword(s):  
Manufacturing Process ◽  
Semiconductor Manufacturing ◽  
Working Environment

scholarly journals Characterization of Waste From Attiéké Factory: Case of Azito Village (Abidjan, Côte d’Ivoire)

2016 ◽  
Vol 12 (35) ◽  
pp. 73
Author(s):  
Kpata-Konan Nazo Edith ◽  
Konan Koffi Felix ◽  
Kouame Yao. Francis ◽  
Gnagne Theophile ◽  
Tano Kablan
Keyword(s):  
Anaerobic Digestion ◽  
Solid Waste ◽  
Manufacturing Process ◽  
Physicochemical Parameters ◽  
Working Environment ◽  
Optimal Conditions ◽  
Synthetic Fibers ◽  
Average Quantity

The control of the anaerobic digestion of cassava residues from attiéké factories requires their characterization to offer a better working environment to attiéké producers. This study concerns at first the quantity of solid residues of cassava, dough of crushed cassava and other waste generated by the process of attiéké production. The second aspect concerns the determination of some physicochemical parameters (COD, TKN, pH, COD/TKN). These two aspects were realized thanks to the use of a bag in synthetic fibers, a dynamometric steelyard with dial of diameter 17 cms, and the use of a gradual can of capacity 20 L. The results of this study showed that an average quantity of 1.53 tonne of manioc handled (treated) generates 1.14 m3 of effluents and 0.16 tonne of solid waste per day. These effluents are acid with a pH ranged between 2.54 and 4.80. So they have on average a DCO of 58.79 g/L for 0,71 g/L of nitrogen. All these parameters help control the optimal conditions of anaerobic digestion of cassava effluents in the manufacturing process of attiéké.

NanoProbing on 7 nm FinFET Devices in an SRAM Array: Challenges and Solutions

2019 ◽  
Author(s):  
Anqi Qiu ◽  
William Lowe ◽  
Mridul Arora
Keyword(s):  
Manufacturing Process ◽  
Semiconductor Manufacturing

Abstract Nanoprobing systems have evolved to meet the challenges from recent innovations in the semiconductor manufacturing process. This is demonstrated through an exhibition of standard SRAM measurements on TSMC 7 nm FinFET technology. SEM based nanoprober is shown to meet or exceed the requirements for measuring 7nm technology and beyond. This paper discusses in detail of the best-known methods for nanoprobing on 7nm technology.

Manufacturing Process for Extracting Essential Oils from White Pepper (Piper nigrum L.) by Hydrodistillation Technique

2019 ◽  
Vol 298 ◽  
pp. 89-93 ◽  
Author(s):  
Thien Hien Tran ◽  
Thi To Quyen Ngo ◽  
Thi Kim Ngan Tran ◽  
Tri Duc Lam ◽  
Tan Phat Dao ◽  
...  
Keyword(s):  
Essential Oil ◽  
Essential Oils ◽  
Manufacturing Process ◽  
Oil Extraction ◽  
Piper Nigrum ◽  
Optimal Conditions ◽  
Distillation Process ◽  
White Pepper ◽  
Oil Performance

Vietnam is the world's leading country in growing and producing pepper trees. In this study, we attempted the optimization of white pepper essential oil extraction. The obtained oil was then subject to determination of constituent composition via GC-MS method. The essential oil performance achieved 3.6% by hydro-distillation process with optimal conditions (25 grams of fresh pepper, size 18, 120 minutes extraction, 130°C). A total of 23 volatile constituents were identified from the white pepper essential oil, with the major components being 27.4% of Limonene, 3-Carene 22,928%, Sabinene 17,622%, β-pinene 10.068%, α-Pinene 5.426%.

On-the-Fly Substrate Eccentricity Recognition for Robotized Manufacturing Systems

2005 ◽  
Vol 127 (1) ◽  
pp. 206-216 ◽  
Author(s):  
Martin Hosek ◽  
Jan Prochazka
Keyword(s):  
Optical Sensors ◽  
Semiconductor Manufacturing ◽  
Manufacturing Systems ◽  
Robotic Manipulator ◽  
End Effector ◽  
Transfer Path ◽  
The Difference ◽  
Manufacturing Applications ◽  
Actual Location

This paper describes a method for on-the-fly determination of eccentricity of a circular substrate, such as a silicon wafer in semiconductor manufacturing applications, carried by a robotic manipulator, where eccentricity refers to the difference between the actual location of the center of the substrate and its desired position on the end-effector of the robotic manipulator. The method utilizes a pair of external optical sensors located along the substrate transfer path. When moving a substrate along the transfer path, the robotic manipulator captures the positions and velocities of the end-effector at which the edges of the substrate are detected by the sensors. These data along with the expected radius of the substrate and the coordinates of the sensors are used to determine the eccentricity of the substrate. This information can be used by the robotic manipulator to compensate for eccentricity of the substrate when performing a place operation, resulting in the substrate being placed centered regardless of the amount and direction of the initial eccentricity. The method can also be employed to detect a defect, such as breakage, of a circular substrate and report an error condition which can abort or otherwise adjust operation of the robotic manipulator.

An empirical study-based state space model for multilayer overlay errors in the step-scan lithography process

RSC Advances ◽  
2015 ◽  
Vol 5 (126) ◽  
pp. 103901-103906 ◽  
Author(s):  
Fuyun He ◽  
Zhisheng Zhang
Keyword(s):  
Empirical Study ◽  
State Space ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Semiconductor Manufacturing ◽  
State Space Model ◽  
Key Factors ◽  
Space Model ◽  
Lithography Process ◽  
Multistage Manufacturing

In semiconductor manufacturing, the multilayer overlay lithography process is a typical multistage manufacturing process; one of the key factors that restrict the reliability and yield of integrated circuit chips is overlay error between the layers.

scholarly journals Financial Feasibility Analysis of Processing Tumpi on The Home Industry Scale in The Sub-District Kulisusu Utara, North Buton Utara Regency

2020 ◽  
Vol 1 (1) ◽  
pp. 71
Author(s):  
Sahrim Sahrim ◽  
La Rianda ◽  
Dhian Herdhiansyah
Keyword(s):  
Manufacturing Process ◽  
Return On Investment ◽  
Raw Materials ◽  
Business Owners ◽  
Feasibility Analysis ◽  
Business Units ◽  
Financial Feasibility ◽  
Break Even Point ◽  
Supporting Materials

This study aims to determine the manufacturing process and the financial feasibility of pile processing. This research was conducted in Kulisusu District, North Buton Regency. The population in this study were all business owners of pile processing. The determination of the sample is done by purposive (direct appointment) because the pedicab processing business actor only consists of two business units. Samples taken are as many as two business units consisting of all existing populations. The variables in this study are raw materials, supporting materials, labor and equipment. The results showed a 12%/yr NPV calculation in 1%/month. At a discount factor of 1% which is equal to Rp 14.546.944. BCR of 1,16 (>1), IRR of 5% (>1%) and return on investment by calculating PP for 9,92 months, BEP units/production of 288 packages and BEP for Rp 2.486. BEP analysis had reached the break-even point that was determined, namely 1. From the five criteria used, it was indicated that the pile processing in the Kulisusu sub-district was feasible to be developed.

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