Destruction mechanism of PT and NPT-IGBTs in the short circuit operation-an estimation from the quasi-stationary simulations

Author(s):  
I. Takata
2015 ◽  
Vol 28 (1) ◽  
pp. 1-15 ◽  
Author(s):  
Riteshkumar Bhojani ◽  
Thomas Basler ◽  
Josef Lutz ◽  
Roland Jakob

This paper demonstrates the detailed work on high voltage IGBTs using simulations and experiments. The current-voltage characteristics were measured up to the break through point in forward bias operating region at two different temperatures for a 50 A/4.5 kV rated IGBT chip. The experimentally measured data were in good agreement with the simulation results. It was also shown that the IGBTs are able to clamp high collector-emitter voltages although a low gate turn-off resistor in combination with a high parasitic inductance was applied. Uniform 4-cell and 8-cell IGBT models were created into the TCAD device simulator to conduct an investigation. An engendered filamentation behaviour during short-circuit turn-off was briefly reviewed using isothermal as well as thermal simulations and semiconductor approaches for development of filaments. The current filament inside the active cells of the IGBT is considered as one of the possible destruction mechanism for the device failure.


Author(s):  
L. P. Lemaire ◽  
D. E. Fornwalt ◽  
F. S. Pettit ◽  
B. H. Kear

Oxidation resistant alloys depend on the formation of a continuous layer of protective oxide scale during the oxidation process. The initial stages of oxidation of multi-component alloys can be quite complex, since numerous metal oxides can be formed. For oxidation resistance, the composition is adjusted so that selective oxidation occurs of that element whose oxide affords the most protection. Ideally, the protective oxide scale should be i) structurally perfect, so as to avoid short-circuit diffusion paths, and ii) strongly adherent to the alloy substrate, which minimizes spalling in response to thermal cycling. Small concentrations (∼ 0.1%) of certain reactive elements, such as yttrium, markedly improve the adherence of oxide scales in many alloy systems.


Endoscopy ◽  
2006 ◽  
Vol 38 (11) ◽  
Author(s):  
A Patel ◽  
DL Bovell ◽  
AD Corbett ◽  
RJ Holdsworth

2017 ◽  
Vol 26 (102) ◽  
pp. 110-119
Author(s):  
D. S. Yarymbash, ◽  
◽  
S. T. Yarymbash, ◽  
T. E. Divchuk, ◽  
D. A. Litvinov

2013 ◽  
Vol 133 (1) ◽  
pp. 37-44
Author(s):  
Suresh Chand Verma ◽  
Yoshiki Nakachi ◽  
Yoshihiko Wazawa ◽  
Yoko Kosaka ◽  
Takenori Kobayashi ◽  
...  

2019 ◽  
Vol 139 (8) ◽  
pp. 522-526
Author(s):  
Kyoya Nonaka ◽  
Tadashi Koshizuka ◽  
Eiichi Haginomori ◽  
Hisatoshi Ikeda ◽  
Takeshi Shinkai ◽  
...  

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