scholarly journals Tools for Broadband Electromagnetic Modeling of Power Semiconductor Packages and External Circuit Layouts

Author(s):  
Ivana Kovacevic-Badstuebner ◽  
Ulrike Grossner ◽  
Dan Popescu
Author(s):  
Salvatore Race ◽  
Ivana Kovacevic-Badstuebner ◽  
Michel Nagel ◽  
Thomas Ziemann ◽  
Shweta Tiwari ◽  
...  

Energies ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2835
Author(s):  
Ivana Kovacevic-Badstuebner ◽  
Daniele Romano ◽  
Giulio Antonini ◽  
Jonas Ekman ◽  
Ulrike Grossner

Broadband electromagnetic (EM) modeling increases in importance for virtual prototyping of advanced power electronics systems (PES), enabling a more accurate prediction of fast switching converter operation and its impact on energy conversion efficiency and EM interference. With the aim to predict and reduce an adverse impact of parasitics on the dynamic performance of fast switching power semiconductor devices, the circuit-oriented EM modeling based on the extraction of equivalent lumped R-L-C-G circuits is frequently selected over the Finite Element Method (FEM)-based EM modeling, mainly due to its lower computational complexity. With requirements for more accurate virtual prototyping of fast-switching PES, the modeling accuracy of the equivalent-RLCG-circuit-based EM modeling has to be re-evaluated. In the literature, the equivalent-RLCG-circuit-based EM techniques are frequently misinterpreted as the quasi-static (QS) 3-D Partial Element Equivalent Circuit (PEEC) method, and the observed inaccuracies of modeling HF effects are attributed to the QS field assumption. This paper presents a comprehensive analysis on the differences between the QS 3-D PEEC-based and the equivalent-RLCG-circuit-based EM modeling for simulating the dynamics of fast switching power devices. Using two modeling examples of fast switching power MOSFETs, a 3-D PEEC solver developed in-house and the well-known equivalent-RLCG-circuit-based EM modeling tool, ANSYS Q3D, are compared to the full-wave 3-D FEM-based EM tool, ANSYS HFSS. It is shown that the QS 3-D PEEC method can model the fast switching transients more accurately than Q3D. Accordingly, the accuracy of equivalent-RLCG-circuit-based modeling approaches in the HF range is rather related to the approximations made on modeling electric-field induced effects than to the QS field assumption.


Author(s):  
Cong Yue ◽  
Jun Lu ◽  
Xiaotian Zhang ◽  
Yueh-Se Ho

RthJA (Junction-to-Ambient Thermal Resistance) for power device packages was measured and modeled in order to correlate the results from our experiments and simulations. The packages studied, including TO (Transistor Outline), DFN (Dual Flat Non-Leaded), SOP (Small Outline Package) and DPAK with sizes from 3×3mm to 15×10mm, were tested under natural convection environment. An important observation from our testing is the significant influence of the external wires connecting the test coupon to the power supply on the thermal resistance value derived from the test data. The increase in the RthJA based on the test is more than 50% for TO packages and 19% for smaller packages once the external wires changed from gauge 18 to 30. A simple yet effective simulation approach was then introduced to predict RthJA incorporating the critical influence from the external wire size variation. With the validated finite element model, the effects of package factors such as package outline, die size, die attach, encapsulation and interconnection on the thermal resistances of the power semiconductor packages were studied by simulation to provide further insights and guides for new package developments.


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