Characterization of a Heat Sink with Embedded Heat Pipe with Variable Heat Dissipating Source Placement for Power Electronics Applications

2018 ◽  
Author(s):  
Neda Mansouri ◽  
Cliff Weasner ◽  
Ahmed Zaghlol
Keyword(s):  
Heat Pipe ◽  
Power Electronics ◽  
Heat Sink ◽  
Variable Heat

Thermal Characterization of Copper Microchannel Heat Sink for Power Electronics Cooling

2009 ◽  
Vol 23 (2) ◽  
pp. 371-380 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Tien Nguyen
Keyword(s):  
Power Electronics ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Thermal Characterization ◽  
Microchannel Heat Sink

scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

3D Characterization of Thermal Fatigue Damage in Monofilament Reinforced Copper for Heat Sink Applications in Fusion Reactor Systems

2012 ◽  
Vol 49 (5) ◽  
pp. 278-289
Author(s):  
M. Schöbel ◽  
H.P. Degischer ◽  
A. Brendel ◽  
B. Harrer ◽  
M. Di Michiel
Keyword(s):  
Fatigue Damage ◽  
Thermal Fatigue ◽  
Heat Sink ◽  
Fusion Reactor

Thermal management of power electronics with liquid cooled metal foam heat sink

2021 ◽  
Vol 163 ◽  
pp. 106796
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Bin Ding ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam

Thermal hydraulic characterization of stainless steel wicks for heat pipe applications

1998 ◽  
Vol 37 (1) ◽  
pp. 5-16 ◽  
Author(s):  
Gianfranco Canti ◽  
Gian Piero Celata ◽  
Maurizio Cumo ◽  
Massimo Furrer
Keyword(s):  
Stainless Steel ◽  
Heat Pipe
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