scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

scholarly journals Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe

2013 ◽  
Author(s):  
Nicholas A. Roche ◽  
Martin Cleary ◽  
Teresa B. Peters ◽  
Evelyn N. Wang ◽  
John G. Brisson
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Computational Simulation ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Operating Characteristics ◽  
Side Pressure ◽  
Compensation Chamber ◽  
Dry Out

We report the design and analysis of a novel compensation chamber for use in PHUMP, a multiple condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The compensation chamber is integrated into the evaporator of the device and provides a region for volumetric expansion of the working fluid over a range of operating temperatures. Additionally, the compensation chamber serves to set the liquid side pressure of the device, preventing both flooding of the condensers and dry out of the evaporator. The compensation chamber design was achieved through a combination of computational simulation using COMSOL Multiphysics and models developed based on experimental work of previous designs. The compensation chamber was fabricated as part of the evaporator using Copper and Monel sintered wicks with various particle sizes to achieve the desired operating characteristics. Currently, the compensation chamber is being incorporated into a multiple condenser LHP for a high performance air-cooled heat sink.

An experimental study on thermal management of concentrated photovoltaic cell using loop heat pipe and heat sink

2019 ◽  
Vol 48 (6) ◽  
pp. 2456-2477 ◽  
Author(s):  
Anand S. ◽  
Senthil Kumar M. ◽  
Balasubramanian K. R. ◽  
Ajith Krishnan R. ◽  
Maheswari L.
Keyword(s):  
Experimental Study ◽  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
Photovoltaic Cell ◽  
Loop Heat Pipe

scholarly journals Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

2013 ◽  
Author(s):  
H. Arthur Kariya ◽  
Daniel F. Hanks ◽  
Wayne L. Staats ◽  
Nicholas A. Roche ◽  
Martin Cleary ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Ambient Air ◽  
Optimal Operation ◽  
Working Fluid ◽  
Air Cooling ◽  
Loop Heat Pipe ◽  
Total Thermal Resistance

We present the characterization of a compact, high performance air-cooled heat sink with an integrated loop heat pipe. In this configuration, heat enters the heat sink at the evaporator base and is transferred within the heat pipe by the latent heat of vaporization of a working fluid. From the condensers, the heat is transferred to the ambient air by an integrated fan. Multiple condensers are used to increase the surface area available for air-cooling, and to ensure the equal and optimal operation of the individual condensers, an additional wick is incorporated into the condensers. We demonstrated with this design (10.2 cm × 10.2 cm × 9 cm), a total thermal resistance of less than 0.1 °C/W while dissipating a heat load of 500 W from a source at 75 °C. Furthermore, constant thermal resistance was observed in the upright as well as sideways orientations. This prototype is a proof-of-concept demonstration of a high performance and efficient air-cooled heat sink design that can be readily integrated for various electronics packaging and data center applications.

Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices

2017 ◽  
Vol 53 (11) ◽  
pp. 3241-3247 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Koichi Mashiko ◽  
Masataka Mochizuki
Keyword(s):  
Heat Pipe ◽  
High Performance ◽  
Electronic Devices ◽  
Cooling Module

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Heat Pipe Optimization Team: The Heat Pipe Assisted Heat Sink Project

2004 ◽  
Author(s):  
Damena Agonafer ◽  
Juan Ibarra ◽  
Kendrick McGee ◽  
Frank Platt ◽  
Kendall Harris ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
Cell Phone ◽  
Transfer Cell ◽  
Customer Requirements ◽  
High Increase ◽  
Phone Calls ◽  
Thermal Solution ◽  
Base Transceiver Station

The Heat Pipe Assisted Heat Sink (HPAHS) team will be working on solving challenging thermal management problems for a device known as the base transceiver station (BTS); a device used to transfer cell phone calls. This problem was raised due to transfer cell phone calls. This problem was raised due to the high use of cell phone in recent years. According to 2002 Scarborough Research, the number of cell phones in US was 180 million (2/3 of population). Due to this high increase in demand for cell phone usage, Replacement Handset Shipments are projected to increase worldwide from Current 40% of total shipments to almost 85%. This will increase from 211 million in 2002 to 591 million by 2008 (Nokia). Cell phone calls are transferred via a device known as the base transceiver station (BTS). Cell phone companies are increasing the performance of the BTS by adding more electronics. Nokia is increasing the current BTS performance by adding another power amplifier. We will encounter the problem of designing the thermal solution to ensure optimal thermal performance, while meeting customer requirements of cost and manufacturing process.

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