Automated Detection of Bleeding in Capsule Endoscopy using on-chip Multispectral Imaging Sensors

2020 ◽  
pp. 1-1
Author(s):  
Mohammad Reza Mohebbian ◽  
Md Hanif Ali Sohag ◽  
Seyed Shahim Vedaei ◽  
Khan A. Wahid
1999 ◽  
Vol 68 (3) ◽  
pp. 194-205 ◽  
Author(s):  
Magdeleine Dinguirard ◽  
Philip N. Slater

2019 ◽  
Vol 9 (12) ◽  
pp. 2404 ◽  
Author(s):  
Sudhir Sornapudi ◽  
Frank Meng ◽  
Steven Yi

The early detection of polyps could help prevent colorectal cancer. The automated detection of polyps on the colon walls could reduce the number of false negatives that occur due to manual examination errors or polyps being hidden behind folds, and could also help doctors locate polyps from screening tests such as colonoscopy and wireless capsule endoscopy. Losing polyps may result in lesions evolving badly. In this paper, we propose a modified region-based convolutional neural network (R-CNN) by generating masks around polyps detected from still frames. The locations of the polyps in the image are marked, which assists the doctors examining the polyps. The features from the polyp images are extracted using pre-trained Resnet-50 and Resnet-101 models through feature extraction and fine-tuning techniques. Various publicly available polyp datasets are analyzed with various pertained weights. It is interesting to notice that fine-tuning with balloon data (polyp-like natural images) improved the polyp detection rate. The optimum CNN models on colonoscopy datasets including CVC-ColonDB, CVC-PolypHD, and ETIS-Larib produced values (F1 score, F2 score) of (90.73, 91.27), (80.65, 79.11), and (76.43, 78.70) respectively. The best model on the wireless capsule endoscopy dataset gave a performance of (96.67, 96.10). The experimental results indicate the better localization of polyps compared to recent traditional and deep learning methods.


2020 ◽  
Vol 91 (3) ◽  
pp. 606-613.e2 ◽  
Author(s):  
Eyal Klang ◽  
Yiftach Barash ◽  
Reuma Yehuda Margalit ◽  
Shelly Soffer ◽  
Orit Shimon ◽  
...  

2016 ◽  
Author(s):  
S. Craig Olson ◽  
Timothy D. Goodman ◽  
Andrew W. Sparks ◽  
Craig S. Wheeler

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002374-002398
Author(s):  
Zhiwei (Tony) Gong ◽  
Scott Hayes ◽  
Navjot Chhabra ◽  
Trung Duong ◽  
Doug Mitchell ◽  
...  

Fan-out wafer level packaging (FO-WLP) has become prevalent in past two years as a package option with large number of pin count. As the result of early development, the single die packages with single-sided redistribution has reached the maturity to take off. While the early applications start to pay back the investment on the technology, the developments have shifted to more advanced packaging solutions with System-in-Package (SiP) and 3D applications. The nature of the FO-WLP interconnect along with the material compatibility and process capability of the Redistributed Chip Package (RCP) have enabled Freescale to create novel System-in-Package (SiP) solutions not possible in more traditional packaging technologies or Systems-on-Chip. Simple SiPs using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or a substrate based multi-chip module (MCM). More complex three dimensional (3D) SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMDs, CMOS, GaAs, MEMS, imaging sensors or IPDs gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. The following paper further discusses SiP advantages, applications and examples created with the RCP technology. Rozalia/Ron ok move from 2.5/3D to Passive 1-4-12.


Author(s):  
Sui-Xian Li ◽  
Da-Qi Xu ◽  
Li-Yan Zhang ◽  
Jun Lin

Previous research has shown that the effectiveness of selecting filter set from a large set of commercial broadband filters by vector analyzing method based on maximum linear independence (MLI). However, the traditional MLI is suboptimal due to predefining the first filter of the selected filter set being the maximum ℓ2 norm among all those of the filters. An exhaustive imaging simulation is conducted to investigate the features of the most competent filter set. In the simulation, every filter in a subset of all the filters is selected serving as the first filter in turn. From the results of the simulation, we found there are remarkable characteristics for the most competent filter set. Besides smaller condition number, the geometric features of the best-performed filter set comprise the distinct peak of the transmittance of the first filter, the generally uniform distributing of the peaks of the transmittance curve of the filters, the substantial overlapping of the transmittance curves with those of the adjacent filer sets. Therefore, the best-performed filter sets can be decided intuitively by simple vector analyzing and just a few experimental verifications. This work would be useful for optimizing spectral sensitivity of broadband multispectral imaging sensors or SFA sensors.


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