scholarly journals High-Performance 50µm Silicon-Based On-Chip Antenna with High Port-to-Port Isolation Implemented by Metamaterial and SIW Concepts for THz Integrated Systems

Author(s):  
Mohammad Alibakhshikenari ◽  
Bal S. Virdee ◽  
Chan H. See ◽  
Raed A. Abd-Alhameed ◽  
Francisco Falcone ◽  
...  
Author(s):  
Kai Xu ◽  
Bao Yue Zhang ◽  
Yihong Hu ◽  
Muhammad Waqas Khan ◽  
Rui Ou ◽  
...  

A 2D Ga2S3 enabled all-optical switch is realized upon a silicon-based on-chip platform. With the unique optical properties of the 2D nanoflakes, the device exhibits excellent switching behaviors driven by visible light at a low power density.


2012 ◽  
Vol 67 (1) ◽  
pp. 100-104 ◽  
Author(s):  
Kenji Okabe ◽  
Wanghoon Lee ◽  
Yasoo Harada ◽  
Makoto Ishida

Author(s):  
Qiuhao Li ◽  
Weiwen Li ◽  
Bocong Ren ◽  
Liangcai Zhang ◽  
Baoping Zhang

Electronics ◽  
2020 ◽  
Vol 9 (7) ◽  
pp. 1137
Author(s):  
Changmin Lee ◽  
Jinho Jeong

In this paper, we design a THz CMOS on-chip patch antenna with defected ground structure (DGS) and utilize it to implement a broadband and high gain on-chip antenna array. It is verified from the simulation that the DGS not only can increase the gain and bandwidth of the antenna element, but also can increase the isolation between the antenna elements in the on-chip array. Therefore, it allows the design of the compact 1 × 2 and 2 × 2 on-chip antenna array with high gain and broad bandwidth. The element spacing and feedline structures of the antenna array are designed and optimized by the simulations. The designed antenna element, and 1 × 2 and 2 × 2 antenna arrays are fabricated in a commercial 65 nm CMOS process. In the on-wafer measurement, they exhibit an antenna gain of 3.1 dBi, 7.2 dBi, and 8.2 dBi with a bandwidth of 14.0%, 21.3%, and 28.0% for the reflection coefficient less than −10 dB, respectively, at 300 GHz. This result corresponds to very good performance compared to the reported THz CMOS on-chip antenna array. Therefore, the designed CMOS on-chip antenna element and array using DGS in this work can be effectively applied to build low-cost and high performance THz systems, because they can be fully implemented in a conventional CMOS process without requiring any additional processes or manufacturing techniques.


Author(s):  
Mohammad Alibakhshikenari ◽  
Naser Ojaroudi Parchin ◽  
Bal Singh Virdee ◽  
Chan Hwang See ◽  
Raed A. Abd-Alhameed ◽  
...  

Author(s):  
A. Ferrerón Labari ◽  
D. Suárez Gracia ◽  
V. Viñals Yúfera

In the last years, embedded systems have evolved so that they offer capabilities we could only find before in high performance systems. Portable devices already have multiprocessors on-chip (such as PowerPC 476FP or ARM Cortex A9 MP), usually multi-threaded, and a powerful multi-level cache memory hierarchy on-chip. As most of these systems are battery-powered, the power consumption becomes a critical issue. Achieving high performance and low power consumption is a high complexity challenge where some proposals have been already made. Suarez et al. proposed a new cache hierarchy on-chip, the LP-NUCA (Low Power NUCA), which is able to reduce the access latency taking advantage of NUCA (Non-Uniform Cache Architectures) properties. The key points are decoupling the functionality, and utilizing three specialized networks on-chip. This structure has been proved to be efficient for data hierarchies, achieving a good performance and reducing the energy consumption. On the other hand, instruction caches have different requirements and characteristics than data caches, contradicting the low-power embedded systems requirements, especially in SMT (simultaneous multi-threading) environments. We want to study the benefits of utilizing small tiled caches for the instruction hierarchy, so we propose a new design, ID-LP-NUCAs. Thus, we need to re-evaluate completely our previous design in terms of structure design, interconnection networks (including topologies, flow control and routing), content management (with special interest in hardware/software content allocation policies), and structure sharing. In CMP environments (chip multiprocessors) with parallel workloads, coherence plays an important role, and must be taken into consideration.


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