A CMOS voltage-controlled oscillator using high-Q on-chip inductor implemented in a wafer-level package

2006 ◽  
Author(s):  
Sang-Woong Yoon ◽  
S. Pinel ◽  
J. Laskar
Keyword(s):  
Voltage Controlled Oscillator ◽  
Wafer Level ◽  
High Q ◽  
On Chip ◽  
Wafer Level Package

A low phase noise LC-VCO with a high-Q inductor fabricated by wafer level package technology

2008 ◽  
Author(s):  
Kazuma Ohashi ◽  
Yuka Kobayashi ◽  
Hiroyuki Ito ◽  
Kenichi Okada ◽  
Hideki Hatakeyama ◽  
...  
Keyword(s):  
Phase Noise ◽  
Wafer Level ◽  
High Q ◽  
Wafer Level Package ◽  
Low Phase Noise ◽  
Lc Vco

On-chip Spiral Inductors Integrated with Wafer-Level Package

2004 ◽  
Author(s):  
Masakazu Sato ◽  
Kazuhisa Itoi ◽  
Hiroshi Abe ◽  
Hirotaka Sugawara ◽  
Hiroyuki Ito ◽  
...  
Keyword(s):  
Wafer Level ◽  
Spiral Inductors ◽  
On Chip ◽  
Wafer Level Package

scholarly journals High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

Sensors ◽  
2017 ◽  
Vol 17 (3) ◽  
pp. 599 ◽  
Author(s):  
Liying Wang ◽  
Xiaohui Du ◽  
Lingyun Wang ◽  
Zhanhao Xu ◽  
Chenying Zhang ◽  
...  
Keyword(s):  
Pressure Sensor ◽  
High Performance ◽  
Anodic Bonding ◽  
Wafer Level ◽  
High Q ◽  
Wafer Level Package

On-Chip High-$Q$Variable Inductor Using Wafer-Level Chip-Scale Package Technology

2006 ◽  
Vol 53 (9) ◽  
pp. 2401-2406 ◽  
Author(s):  
K. Okada ◽  
H. Sugawara ◽  
H. Ito ◽  
K. Itoi ◽  
M. Sato ◽  
...  
Keyword(s):  
Wafer Level ◽  
High Q ◽  
Chip Scale Package ◽  
Variable Inductor ◽  
On Chip
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