A 1-Mbps 1.6-μA Micro-power Active-RFID CMOS LSI for the 300-MHz Frequency Band

Author(s):  
K. Suzuki ◽  
M. Ugajin ◽  
M. Harada
2020 ◽  
Vol E103.C (11) ◽  
pp. 588-596
Author(s):  
Masamune NOMURA ◽  
Yuki NAKAMURA ◽  
Hiroo TARAO ◽  
Amane TAKEI

2014 ◽  
Vol 73 (11) ◽  
pp. 993-1003 ◽  
Author(s):  
R. V. Golovashchenko ◽  
V. N. Derkach ◽  
M. K. Zaetz ◽  
V. G. Korzh ◽  
A. S. Plevako ◽  
...  
Keyword(s):  

2008 ◽  
Vol 67 (13) ◽  
pp. 1207-1215 ◽  
Author(s):  
V. K. Kiselyov ◽  
M. S. Yanovsky ◽  
V. I. Bezborodov ◽  
Ye. M. Kuleshov

Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


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