A Thin-Film SOI 180nm CMOS RF Switch Technology

This paper presents a novel experimental method to investigate the strength of material, Al-3%Ti, which is commonly used in RF(radio frequency) microelectromechanical systems(MEMS) switch. The experimental method involves the development of a new tensile loading system. The new tensile loading system has a load cell with maximum capacity of 0.5N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. A voice coil of audio speaker is used as the actuator of the loading system. And new specimen was designed and fabricated to easily manipulate, align and grip a thin-film for a tensile and fatigue test. The material used in this study was Al-3%Ti thin film, which was used in RF switch. The thickness and width of the thin film of specimen are 1.1µm and 480µm, respectively. The holes at center of grip end are able to make alignment and gripping easy. The bridges are to remove the side supports easily and extract specimen from wafer without sawing. Tensile tests were performed on 5 specimens. The ultimate strength of Al-3%Ti was 144MPa.

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Investigation of Plasma Charging damage impact on device and gate dielectric reliability in 180nm SOI CMOS RF switch technology

2009 IEEE International Reliability Physics Symposium ◽

10.1109/irps.2009.5173401 ◽

2009 ◽

Cited By ~ 1

Author(s):

D.P. Ioannou ◽

D. Harmon ◽

W. Abadeer

Keyword(s):

Gate Dielectric ◽

Rf Switch ◽

Damage Impact ◽

Cmos Rf ◽

Soi Cmos

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Novel Test Procedure of Tensile Test for MEMS Materials

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.321-323.136 ◽

2006 ◽

Vol 321-323 ◽

pp. 136-139 ◽

Cited By ~ 6

Author(s):

Jun Hyub Park ◽

Yun Jae Kim ◽

Man Sik Myung ◽

Chang Seung Lee ◽

Sung Hoon Choa ◽

...

Keyword(s):

Thin Film ◽

Mass Production ◽

Test Procedure ◽

Tensile Tests ◽

Test Machine ◽

Mems Devices ◽

Rf Switch ◽

Present Specimen ◽

Setting Process ◽

Test Film

This paper describes a novel test procedure, new structure of specimen easy to manipulate, align and grip a thin-film and test machine for a tensile and fatigue test. For the proposed specimen, the surroundings of the specimen including the side support strips except for six bridges are etched during the fabrication of the specimen, which in turn makes it possible to cut off easily the specimen from the wafer by minimizing a damage to the test film and also possible to produce the specimen in mass production. For the present specimen, a small hole is made at the grip end and using a small pin for setting the specimen onto the tester, the setting process and alignment of specimen is much easier, compared to the specimen proposed by Sharpe et al. To gain confidence in reliability of testing results, pre-test using the Al-3%Ti is performed, which is widely used in the RF switch and other MEMS devices. Tensile tests are performed, from which tensile strengths of the Al-3%Ti are measured as 343±16.22MPa at 200μm width and 1.1μm thickness.

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CMOS RF Switch with Fast Discharge Feature

IEEE Solid-State Circuits Letters ◽

10.1109/lssc.2021.3059918 ◽

2021 ◽

pp. 1-1

Author(s):

Valentyn Solomko ◽

Oguzhan Oezdamar ◽

Robert Weigel ◽

Amelie Hagelauer

Keyword(s):

Rf Switch ◽

Fast Discharge ◽

Cmos Rf

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In-plane displacements in thin-film blistering

Proceedings of the Royal Society of Edinburgh Section A Mathematics ◽

10.1017/s0308210502000446 ◽

2002 ◽

Vol 132 (04) ◽

pp. 911

Keyword(s):

Thin Film

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Clean Electron Microscope Substrate Films Used for Micrometeorite Collection and Study

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100061847 ◽

1967 ◽

Vol 25 ◽

pp. 366-367

Author(s):

D. M. Davies ◽

R. Kemner ◽

E. F. Fullam

Keyword(s):

Thin Film ◽

Electron Microscope ◽

High Altitude ◽

Amyl Acetate ◽

Temperature Variations ◽

Film Forming ◽

Film Specimen ◽

Particulate Contaminants

All serious electron microscopists at one time or another have been concerned with the cleanliness and freedom from artifacts of thin film specimen support substrates. This is particularly important where there are relatively few particles of a sample to be found for study, as in the case of micrometeorite collections. For the deposition of such celestial garbage through the use of balloons, rockets, and aircraft, the thin film substrates must have not only all the attributes necessary for use in the electron microscope, but also be able to withstand rather wide temperature variations at high altitude, vibration and shock inherent in the collection vehicle's operation and occasionally an unscheduled violent landing.Nitrocellulose has been selected as a film forming material that meets these requirements yet lends itself to a relatively simple clean-up procedure to remove particulate contaminants. A 1% nitrocellulose solution is prepared by dissolving “Parlodion” in redistilled amyl acetate from which all moisture has been removed.

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