Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance

Abstract The need for compactness and efficiency of processing devices has kept increasing rapidly over the past few years. This need for compactness has driven the dice to be stacked one above the other. But with this come the difficulty of heat dissipation and its characterization because there are multiple heat sources and a single effective heat-conductive path. Hence, it becomes important to know the distribution and characterization of heat and temperature to provide effective cooling systems. In this article, we discuss the temperature distribution of various power configurations on stacked dice with five dice, when the dice are in staggered arrangement. The simulations have been carried out for both free convection and forced convection conditions using the ANSYS commercial software. The linear Superposition principle (LSP) is demonstrated on these configurations and validated with the results obtained from ANSYS simulation. LSP can be applied for the quick estimation of die temperatures with negligible error.

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Comparison of diodes and resistors for measuring chip temperature during thermal characterization of electronic packages using thermal test chips

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566797 ◽

2002 ◽

Cited By ~ 14

Author(s):

A. Claassen ◽

H. Shaukatullah

Keyword(s):

Thermal Characterization ◽

Electronic Packages ◽

Chip Temperature ◽

Thermal Test ◽

Test Chips

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Automated stand for thermal characterization of electronic packages

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767200 ◽

2011 ◽

Cited By ~ 10

Author(s):

M. Janicki ◽

Z. Kulesza ◽

T. Torzewicz ◽

A. Napieralski

Keyword(s):

Thermal Characterization ◽

Electronic Packages

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Thermal characterization of silicon integrated spiral inductors by thermal impedance using transient thermography – first approach

Proceedings of the 2010 International Conference on Quantitative InfraRed Thermography ◽

10.21611/qirt.2010.064 ◽

2010 ◽

Author(s):

M. Kaluza ◽

G. Papagiannopoulos ◽

B. Więcek ◽

V. Chatziathanasiou ◽

A. Hatzopoulos ◽

...

Keyword(s):

Thermal Characterization ◽

Thermal Impedance ◽

Transient Thermography ◽

Spiral Inductors

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Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

Journal of Electronic Packaging ◽

10.1115/1.1287928 ◽

2000 ◽

Vol 122 (3) ◽

pp. 233-239 ◽

Cited By ~ 30

Author(s):

J. R. Culham ◽

M. M. Yovanovich ◽

T. F. Lemczyk

Keyword(s):

Fourier Series ◽

Boundary Conditions ◽

Series Solution ◽

Analytical Approach ◽

Printed Circuit Boards ◽

Three Dimensional ◽

Thermal Characterization ◽

Steady State Solution ◽

Electronic Packages

The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1]

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