Enhancements of Substrate Deposition Rate and Target Erosion Profile in a DC Magnetron Sputtering System

2009 ◽  
Vol 45 (10) ◽  
pp. 4391-4394 ◽  
Author(s):  
Cheng-Tsung Liu ◽  
Ming-Chih Lai ◽  
Chang-Chou Hwang ◽  
Chun-Hung Tu ◽  
Li-Yang Liu ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Deposition Rate ◽  
Dc Magnetron Sputtering ◽  
Sputtering System

Tunable ion flux density and its impact on AlN thin films deposited in a confocal DC magnetron sputtering system

2018 ◽  
Vol 348 ◽  
pp. 159-167 ◽  
Author(s):  
M. Trant ◽  
M. Fischer ◽  
K. Thorwarth ◽  
S. Gauter ◽  
J. Patscheider ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Flux Density ◽  
Ion Flux ◽  
Dc Magnetron Sputtering ◽  
Sputtering System

scholarly journals Hands-on project aimed at technical education: realizing a dc magnetron sputtering system

2021 ◽  
Author(s):  
Sonny Massahi ◽  
Desiree Ferreira ◽  
Michael Avngaard ◽  
Aksel Christensen ◽  
Daniel Haugbølle ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Technical Education ◽  
Dc Magnetron Sputtering ◽  
Hands On ◽  
Sputtering System

Paschen curve approach to investigate electron density and deposition rate of Cu in magnetron sputtering system

2016 ◽  
Vol 171 (11-12) ◽  
pp. 999-1005
Author(s):  
S. Gopikishan ◽  
I. Banerjee ◽  
K. A. Bogle ◽  
A. K. Das ◽  
A. P. Pathak ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Electron Density ◽  
Deposition Rate ◽  
Paschen Curve ◽  
Sputtering System

FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING

2018 ◽  
Vol 25 (05) ◽  
pp. 1850097
Author(s):  
QIJING LIN ◽  
WEIXUAN JING ◽  
ZHUANGDE JIANG ◽  
NA ZHAO ◽  
ZIRONG WU ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Rapid Thermal Annealing ◽  
Dc Magnetron Sputtering ◽  
Triangular Pyramid ◽  
Single Side ◽  
Surface Patterns ◽  
Cu Thin Film ◽  
Sputtering System

Sandwich stacked Ti/Cu/Si thin films were deposited on a single-side polished Si(111) substrate using DC magnetron sputtering system and annealed using a rapid thermal annealing (RTA) system. Complex dendritic patterns, whose branches are composed of Cu rods and triangular Cu microcrystals were obtained on Ti/Cu thin film annealed at 700[Formula: see text]C. The shape of one triangular Cu microcrystal is a truncated equilateral triangular pyramid with a flat top. Triangular Cu microcrystals grow in the number when Ti/Cu thin films are annealed at 800[Formula: see text]C. Experimental results show that anisotropy affects the growth of surface patterns and the top Ti capping layer works as a protection for the underlying Cu layer from oxidation.

Discharge Characteristics and Deposition Rate of Ta Thin Film by using RF assisted DC Magnetron Sputtering.

Shinku ◽  
1995 ◽  
Vol 38 (3) ◽  
pp. 315-317
Author(s):  
Keishi KAWABATA ◽  
Keiichirou WATANABE ◽  
Kenichi OKA ◽  
Fumio SAKO ◽  
Tomonori YAMAMOTO ◽  
...  
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
Deposition Rate ◽  
Dc Magnetron Sputtering ◽  
Discharge Characteristics

Ti-Ca-P Films Formed by RF Magnetron Sputtering Method Using Dual Targets

2007 ◽  
Vol 544-545 ◽  
pp. 495-498 ◽  
Author(s):  
Akira Watazu ◽  
Katsuhiko Kimoto ◽  
Sonoda Tsutomu ◽  
Kinya Tanaka ◽  
Tomoji Sawada ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Rf Sputtering ◽  
Rf Magnetron Sputtering ◽  
Titanium Implants ◽  
Rf Power ◽  
Dc Magnetron Sputtering ◽  
Dc Power ◽  
Sputtering Power ◽  
Titanium Target ◽  
Sputtering System

Ti-Ca-P films on commercial pure (cp) titanium plates were uniformly deposited using dual target RF magnetron sputtering apparatus with DC magnetron sputtering system under the conditions of 50 W DC power to a cp titanium target and 200 W RF power to a β-tricalcium phosphate (β-TCP) target for 60 min in 2.2×10-1 Pa Ar. Resulting samples had smooth surface like mirror. Crystal structure of the film was amorphous. The film had the chemical composition of about 3: 1.7: 1: 11 in Ti: Ca: P: O ratio under controlling the β-TCP target RF sputtering power and the titanium target DC sputtering power. The film and the method are expected to be useful for remodeling surfaces of various titanium implants.

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